TO Tech-Net:

As an advocate for ENIG for fine pitch designs, I am asking for input on
whether moving towards a silver product
is more efficient a performer at the assembly level. Finishes such as
Alpha Level have been available but have not
replaced the current slate that appears common; ie. white tin or ENIG.

Question: Are silver finishes more cost effective at the board
fabricator while at the same time being process friendly
at the assembler than ENIG or white tin? HASL is not one that I believe
will be an option much longer due to the
de-leading of the inductry so I have not included that choice.

I know the list as addressed facets of this issues in the past however
would appreciate any inputs.

Charlie McMahon.

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