Yes, I was working with the late great Dr. Paul Craven, then at Lamination
Technology Inc, when Phil came in and presented his findings, or lack
thereof, concerning the condition. IPC says in 3.1.8, Resin Recession:

Resin recession in a plated through hole is generally defined as a
separation between the plated barrel of the hole and the dielectric material
on the hole wall. It is acceptable for all classes after thermal stress
testing unless otherwise specified in the procurement documentation.

I think the phrase after thermal stress testing tells most of the story.
Also, IPC, as with many guidelines and acceptance criteria, emphasizes
unless otherwise specified in the procurement documentation. That too tells
a story about not necessarily knowing cause but leaving it to the customer
to make the decision concerning whether or not it is acceptable of cause for
rejection.

Earl Moon

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------