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December 2001

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From:
"Sauer, Steven T." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 5 Dec 2001 09:45:32 -0500
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For starters -- congrats to you and Chris and best wishes for a long and
happy union!
I've been experiencing some soldering challenges these days with a myriad of
component lead surface finishes.
One inquiry to an inductor mfr "what is the base metal and surface finish"
yeilded a response "platinum/palladium/silver".  Typically, I've been
seeing, outside of TI's Palladium, Sn80Pb20 and Sn85Pb15 platings but none
(to my knowledge) have been 100% silver.
My initial recourse was to revamp each reflow profile for a higher reflow
temp (230°C) and longer dwell time (upwards to 60 sec) coupled with standard
Sn62 solder paste (although I would prefer to have the Sn62 with Sb).
As was mentioned during the infamous "IMC string", the CuAg intermetallics
are definitely something to not be overlooked -- as you know more on this
subject than I.
If I come across any peculiar finishes, I'll keep you posted.

Regards,
Steve Sauer
-----Original Message-----
What I am really concerned about right now is component manufacturers, who
in their rush to be lead free, have resorted to using thick, 100% silver
lead finishes.  Have any of the rest of you run into this recently?!

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