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Subject:	Re: How many times can PCB pass through oven
From:	Earl Moon <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 5 Dec 2001 07:20:31 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (18 lines)

Obviously, far more knowledgeable people than me can speak to long term
solder joint reliability. Concerning the MLB, the more times you thermally
stress the structur, the more oxidation (both metals and materials) is
effected. Therefore, innerlaminar bond strength as well as foil bond
strengths are reduced.

Earl Moon

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