Bev

I'm not Werner but Chapter 20 of Jennie Hwang's new book
'Environmentally-friendly Electronics: Lead-Free Technology' from
Electrochemical Publications gives a dissertation on this subject.

Brian

Bev Christian wrote:
>
> Werner,
> Do you know of any good references in the open literature about tin/silver
> Intermetallics?  I would really appreciate any citations you can give me.
> regards,
> Bev Christian
> research in Motion
>
> -----Original Message-----
> From: Werner Engelmaier [mailto:[log in to unmask]]
> Sent: December 3, 2001 10:55 PM
> To: [log in to unmask]
> Subject: Re: [TN] Increasing Silver thinkness in immersion Plating
>
> Hi Rudy,
> Increased Ag thickness may or may not increase solderability shelf life, but
> it would do one thing for sure, reduce solder joint reliability. 'Gold
> embrittlement' is nothing compared to what too much Ag-Sn IMCs do.
>
> Werner Engelmaier
>
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