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Subject:	Re: Locating a BGA Rework Service
From:	Earl Moon <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 4 Dec 2001 14:47:45 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (44 lines)

Michael,

I am the best rework guy on the planet - besides Jeff. The big difference is
he is a company owner,CEO. Hell, he's a hotshot an I'm a cat's meow.

Anyway, Jeff can direct you well. However, I simply would say this: It
doesn't matter if you're low or volume or whatever mix, the rework process
is time consuming and must be dedicated to whatever assembly, board, and
device you are using. Jeff, would echo this.

I have been doing BGA and CCGA rework since I can remember - with good
success but for bad designs. Hell, I enjoyed reworking stuff just so I could
correlate findings back to design deficiencies. Though not the only reason,
it is one that got me started on this DFM/CE rant.

Couple of good companies, as always, are SRT and Air-Vac. Like Air-Vac now
because of relative simplicity. No matter, be prepaired to spend much time
on profiling starting with solder paste supplier recommended profiles. Then,
you must go from there developing unique profiles for each assembly and each
part of it. Kinda sounds like my inept wave soldering explanation.

One such profile may consist of a total removal cycle of about 15 minutes.
Then, you must clean and prepair the site for solder paste application using
a micro stencil. Once ready, and all MSD requirements are met, you must
place the device accurately and initiate and perform the reflow cycle. All
in all, you spend about 30 or so minutes doing one device. Therefore,
everything adds up to low volume, high mix.

Just had to do this because of the DFM/CE thing. It's always interesting how
much rework needs doing when the initial design is not right. Of course,
repair and modification offer different explanations.

MoonMan

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