Regards,
George

George M. Wenger (908)-546-4531 [log in to unmask]
Celiant Corporation
40 Technology Drive
Warren, New Jersey 07059


-----Original Message-----
From: Stuart Korringa [mailto:[log in to unmask]]
Sent: Tuesday, December 04, 2001 1:43 PM
To: [log in to unmask]
Subject: [TN] ENIG on thru-hole CCAs


I know we have discussed ENIG and black pad before on this forum
but...what can
be done when you have it on boards that cannot be scrapped or reworked?
Cross-sectioning shows good hole fill and good wetting right up to the
point of
the topside pad. However in worst case areas, there is intrusion of the
black
pad into the PTH about 5% of the way down from the top.

We know the black is oxidized nickel and is unsolderable. Manko in his
book from
1964 speaks of oxidized subsurface metals due to porosity of the gold
flash or
due to uneven gold flash. Has anyone ever measured the thickness or
porosity of
the gold flash? Is it possible?

The visual characteristics of a black pad CCA solder joint are way
outside of
any acceptability standard known to me. Does anyone know of reliability
issues
with a black pad solder joint?

What's a guy to do?

Thanks,

Stu Korringa
Smiths Industries Electronic Systems
Grand Rapids, Mi


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