Seyfi

My experience is that bridging with through-hole components is usually a
function of either doubtful solderability of the component lead and/or
PCB, the wrong chemistry or the poor curing of the solder mask (or
substrate, if there is no mask) - or a combination of any of these.
Solder thieves are usually used on the trailing edge of SMD components
(e.g., QFPs) to ensure that the break-off of the meniscus between the
solder wave and the solderable surface occurs away from the actual
connections, thereby reducing the risk of shorts between closely-spaced
leads. It will not cure bridging because of factors like poor
solderability. I've not heard of temporary thieving - isn't this called
borrowing? :-)

Brian

Seyfi Ozsever wrote:
>
> I am looking for some information in the market about "SOLDER THIEVES"
> that can be temporarily applied on the PCB's (i.e, can be removed after
> soldering) to prevent chronical solder bridge problems  during wave
> soldering.  Some through hole components and/or component leads are
> notorious for having the tendency of getting solder bridges at certain
> spots regardless of the adjustments in the process parameters.
>
> I would appreciate any suggestion or advise in this area.
>
> Thank you,
>
> Seyfi Ozsever
>
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