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December 2001

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Subject:
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sun, 23 Dec 2001 15:32:19 -0600
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Again, the lamination process often is more overlooked than most others. A
basic part of any process management tool must be to audit the process. As
you say, running the lamination process calibration simply is to, on a
regular basis, place the thermocouple "book" into the press openings, using
say 5 places, to determine the profile. It's not much different than
profiling a wave or reflow soldering process. Much else to do but often
overlooked.

MoonMan

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