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December 2001

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Subject:
From:
Steve DiBartolomeo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sun, 23 Dec 2001 11:48:30 -0800
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Technetters...

I have been reading the suggestions about how one
verifies that laminate layers are stacked correctly.

Did you know that a company, Samsung, has actually
"patented" the idea of using offset metal pads near
the edges of the substrate to determine that the
layup is correct.

No way! Yes way! - patent number 6,091,026 (I saw the
patent reviewed in Chip Scale Design Magazine...November
December 2001, page 57)

So all of you using the technique - send your money
to Samsung! And I though that patents had to be non-obvious
to those skilled in the industry ...

========================================================

Steve DiBartolomeo              [log in to unmask]
PC Tools                     Microelectronics Tools

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