Patrick,

If your adhesive process is capable of placing adhesive for 0603 components,
and you are using a selective solder process where solder paste is already
applied to the bottom side, then I would recommend solder paste.  This way
you do not need to alter your component pad size for the 0603 components.
You also do not need to worry about knocking off components during the
handling process at TH insertion.  Another thing is that if you have tall
actives on the bottom side, and are thus using a very thick selective solder
process, I noticed that the small amount of adhesive used for 0603s is not
always strong enough to handle the solder wave as it crashes into the
selective solder pallet opening.  These SMT adhesives were typically
designed to withstand 8lbs of shear that is seen over a typical single or
dual wave process.  Depending on your selective solder pallet thickness, the
part could see 2 or 3 times that force.

Steve A

> -----Original Message-----
> From: Patrick Lam [SMTP:[log in to unmask]]
> Sent: Wednesday,December 19,2001 2:46 PM
> To:   [log in to unmask]
> Subject:      [TN] Wave solder 0603
>
> Hi TechNetters,
>
> I need some advice on putting 0603 parts on the bottom. Should the
> footprint be
> different than the one for reflow? What is the preferred footprint? Is it
> a good
> pratice to use both glue dots and solder paste for wave sodering?
>
> Thanks,
> Patrick
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