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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 20 Dec 2001 12:20:27 +0530 |
Content-Type: | text/plain |
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dear all,
We are member of the IPC for the last fifteen years and has been very
beneficial and extremely useful for us.
We have also been a manufacturer of Multilayer PCBs of higher layer counts
(8 to 18 layers) with aluminum
core and thermal bond options . These are being use for high end
professional end applications in the areas
of Space and Avionics.
We are interested in knowing the following details as per the subject
above.
a) Surface preparation of CIC material of different grades and
thicknesses.
b) Material and method of Insulation (electrical) for the different inner
layers and the CIC Core layer
c) Method of Insulation and Connectivity for the PTH with CIC Core and
inner layers including Through,Burried,
BLIND and Interconnection holes
d)Any specific parameters differences from the normal CCL/PREPREG-FR4
combination for critical processes
like electroless.desmear/etchback,drilling etc.,for the CIC C ORE
Integrated PCBs
Request your valuable feedback to our queries
Regards,
M A Ranganath
GM - Engineering & Quality
Sanmar Micropack Limited
Plot No.16, Jigani Industrial Area,
Bangalore - 562 106. INDIA
Phone: 91 - 80 - 7825223/224/226/389
Fax : 91 - 80 - 7825225
Email : [log in to unmask]
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Thank you.
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