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December 2001

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Subject:
From:
Vinit Verma <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 20 Dec 2001 10:56:57 +0530
Content-Type:
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Hi Pat,

The footprint for wave soldering is ofcourse diferent than the one for
reflow, the difference being the extra protrusion of the pad outside the
component termination and also the gap between the two pads.

Also to be taken care is the orientation of the chip components. Preferably
they should be perpendicular to the PCB flow direction, thus enabling both
the pads to contact the wave simultaneously. This will have the most visible
effect on the tall bodied ceramic caps. In case the comps are parallel to
the PCB flow direction, for the tall bodied caps you'll see insufficient or
no solder at the trailing pad. However, if you have the dual wave soldering
machine, this effect will be minimized, if not eliminated.

For wave soldering SMTs, you need to glue them in order to hold them in
place during wave soldering. Where does the solder paste come into the
picture? What is your purpose of using the solder paste? Not required!

Hope this info is of use.

Regards
Vinit



-----Original Message-----
From: Patrick Lam [mailto:[log in to unmask]]
Sent: Thursday, December 20, 2001 3:16 AM
To: [log in to unmask]
Subject: [TN] Wave solder 0603


Hi TechNetters,

I need some advice on putting 0603 parts on the bottom. Should the footprint
be
different than the one for reflow? What is the preferred footprint? Is it a
good
pratice to use both glue dots and solder paste for wave sodering?

Thanks,
Patrick
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