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December 2001

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Subject:
Re: Assembly of RF boards
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 19 Dec 2001 11:12:21 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (19 lines) 
Sure like what you, and others, say about gold, OSP's, and silver. Wish you
could convince 90% of the other engineers designing as if some very old
"traditions" had merit.

Also, thermal is a concern. Some of the amps get very hot. Some engineers
really fight using any type thermal transfer improvement as grease or whatever.

Earl Moon

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