LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

December 2001

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET December 2001

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Show All Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Subject:	Re: Voiding on BGA with uVias
From:	Earl Moon <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 19 Dec 2001 03:23:03 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (38 lines)

WW91IGhhdmUgbWljcm8tc2VjdGlvbmVkLCBzbyB5b3UgY291bGQgY2hlY2sgdGhlIHJvdWdobmVz
cyBhbmQgcGxhdGluZy

The above means I might agree if I understood what you were trying to say.
Looks good though.

I just wrote some stuff about BGA's in an earlier posting. Dull stuff really
and very old as everyone knows. Some of it may be pertinent here.

I talked about developing a simple process to form micro vias in Kapton. I
used plasma to "drill" 3 to 5 mil holes in 1 mil thick material and bonded
the sheet over the MLB top and bottom. Essentially it was a rigid/flex board
without the flex part. Anyway, the concept worked very well but for some
outgassing issues as I stated before. The cause turned out to be some
problems associated with using a standard acrylic adhesive to bond the
Kapton to the outer layers and effect the plating process. Not that it
matters here, but used the same technique on inner layers as buried vias.
Someone patented the idea, or one similar, for micro vias, not that that
matters here either. Just writing myself a note. Is that legal on this forum?

uvia outgassing can be a problem but shouldn't be so. I can only guess it is
an issue relative to what you are experiencing. Outgassing out of any via is
cause for concern and most causes have been discussed many times. You know
the ones as moisture, process chemical entrapment, and all the rest. Of
course, it could just be entrapped air in the via.

MoonMan

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2

LISTSERV.IPC.ORG