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December 2001

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Subject:
From:
David Fish <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 4 Dec 2001 10:12:38 -0800
Content-Type:
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Look at the Practical Components [http://www.practicalcomponents.com/]
catalog.  It is a nice compendium of package dimensions.

Dave Fish
----- Original Message -----
From: "Werner Engelmaier" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, December 03, 2001 5:28 AM
Subject: [TN] Component Info Needed


> Hi All,
> I asked for some of this information before, but got no response. I am
trying
> to assess the impact of the various thermal masses of components on their
> different reflow temperature profiles.
> However, I do not have enough information. I would appreciate any
information
> any of you could provide. Components of interest are listed below, the
number
> of I/O's could vary of course. What I need is body dimensions, possible
chip
> sizes, component substrate thickness, metal content, etc.:
> 0603 Chip
> 1803 Chip
> 100 I/O QFP
> Plastic 361 I/O BGA
> Plastic 361 I/O SBGA
> Ceramic 361 I/O BGA
>
> Thanks,
> Werner Engelmaier
>
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