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December 2001

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Subject:
From:
David Fish <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 18 Dec 2001 22:53:28 -0800
Content-Type:
text/plain
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text/plain (71 lines)
Given the wide variety of chip bonders out there that have such divergent
properties, why [how] in the world would there be an IPC specification?
Your supplier is an excellent point of reference.

Dave Fish
----- Original Message -----
From: "Vinit Verma" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, December 18, 2001 6:57 PM
Subject: Re: [TN] Pull-Off strength for Surface Mount Adhesives


> Hi Folks,
>
> Hope my question reached all! In case it didn't, here it is again. Please
> give your valuable inputs!
>
> Thanks
>
> Vinit
>
> >  -----Original Message-----
> > From:         Vinit Verma
> > Sent: Friday, December 14, 2001 11:27 AM
> > To:   [log in to unmask]
> > Subject:      Pull-Off strength for Surface Mount Adhesives
> >
> > Hi Technetters,
> >
> > Can anyone tell me where to find the IPC specification for the pull-off
> > and Torque strengths for Surface mount adhesives. I have the test method
> > but not the specification. Of course the glue manufacturer has this
specs
> > written onto the data sheet, but I need to check what is the range
> > specified by the IPC, whether the manufacturers range falls in the IPC
> > range or not!
> >
> > Thanks in anticipation
> >
> > Regards
> > Vinit Verma
> >
> >
>
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