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December 2001

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Subject:
From:
Jana Carraway <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 18 Dec 2001 10:22:48 -0800
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Doug,

All worse case scenarios aside, please let us know what you do to resolve
the problem(s) and how well it works.  It is actually valuable information.
Jana Carraway
Micro Systems Engineering, Inc.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of
[log in to unmask]
Sent: Monday, December 17, 2001 3:29 PM
To: [log in to unmask]
Subject: Re: [TN] Cleaning after plasma


Well, now that we have firmly established that I AM a two headed monster
and should be shot whenever coming within 100 yards of the clean room.....

Yes, I would have preferred not to risk the cross-contamination issue, IF I
COULD.  That plasma cleaner was the only one large enought to handle the
assemblies in question, and I was given all of today to solve a
multimillion dollar potential problem.  So going out of house was not an
option.  We already wash with a saponifier, but that does not increase the
surface roughness of the solder mask or components.  The parameters I
selected were done so with a mild etch in mind, not the aggressive profiles
used for decap.  If you have ever been in a production crunch, you know
that you often get put in positions were you would rather not be if you had
your druthers.

Doug Pauls

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