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December 2001

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Subject:
From:
"Marsico, James" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 18 Dec 2001 06:59:07 -0500
Content-Type:
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text/plain (75 lines)
Just out of curiosity, what problems are you having with the coating process
that warrants plasma cleaning?

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879



        -----Original Message-----
        From:   [log in to unmask]
[SMTP:[log in to unmask]]
        Sent:   Monday, December 17, 2001 6:29 PM
        To:     [log in to unmask]
        Subject:        Re: [TN] Cleaning after plasma

        Well, now that we have firmly established that I AM a two headed
monster
        and should be shot whenever coming within 100 yards of the clean
room.....

        Yes, I would have preferred not to risk the cross-contamination
issue, IF I
        COULD.  That plasma cleaner was the only one large enought to handle
the
        assemblies in question, and I was given all of today to solve a
        multimillion dollar potential problem.  So going out of house was
not an
        option.  We already wash with a saponifier, but that does not
increase the
        surface roughness of the solder mask or components.  The parameters
I
        selected were done so with a mild etch in mind, not the aggressive
profiles
        used for decap.  If you have ever been in a production crunch, you
know
        that you often get put in positions were you would rather not be if
you had
        your druthers.

        Doug Pauls


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