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December 2001

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Subject:
From:
"<Peter George Duncan>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 18 Dec 2001 13:19:20 +0800
Content-Type:
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text/plain (94 lines)
Depends on the thickness tolerence you're specifying. If all layers are to
be 2 oz, and you're using 3.5 mils core & prepreg, it will fab OK but allow
maybe +/- 8 mils fab tolerence. If all the holes are through-holes that's
OK too, but if you have many blind via groups, you'll need more than the
normal processes to make the thing work and keep copper weight and
thickness within the bounds of reason.

Make sure your design is balanced for symetrical copper distribution
throughout the board, and make sure you do a proper thermal profiling job
when it comes to assembly - that amount of copper will absorb a lot of
heat. Make sure everything is properly to temperature before the final
boost to soldering temp.

Peter Duncan



                    Darrel
                    Therriault           To:     [log in to unmask]
                    <DTherriault@        cc:     (bcc: DUNCAN Peter/Asst Prin Engr/ST
                    INCEP.COM>           Aero/ST Group)
                    Sent by:             Subject:     [TN] .050 PWB
                    TechNet
                    <[log in to unmask]
                    ORG>


                    12/14/01
                    02:41 AM
                    Please
                    respond to
                    "TechNet
                    E-Mail
                    Forum."






Technet.....

PWB designer and fab folks........We are considering building an .050"
PWB with 2 oz Cu, 6-8 layers.

Any heartburn or horror stories with this design or is this within
normal capability from the design and fab perspective??

DT




--
Darrel Therriault
VP, Mfg. Operations
INCEP Technologies, Inc
(858)547-9925 223
[log in to unmask]

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