TechNetters, our production people want to investigate an alternative to
the solder paste we are now using.  My proposal was to perform a designed
experiment to see if the candidate paste is better than, worse than, or
equivalent to the present paste.

Factors to consider in an experiment could, in my opinion, include the
pastes themselves, solderability preservative, lead finish, stencil life,
etc.

A big question than comes to my mind is:  what measurement do we use for
soldering performance?  Is there a variable measurement?  I'd rather not
use an attribute measurement, since that, as you know, requires a
relatively large sample size.  I don't like the prospect of using any
subjective measurement, fearing gage uncertainty will be excessive.

Any comments would be most welcome.  Contact me off-line for discussions if
this topic is too narrow for the forum.  Thanks to all.  Lou Hart

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