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December 2001

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Subject:
From:
"Crepeau, Phil" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 17 Dec 2001 11:05:20 -0800
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hi,

i'd be inclined to not let you set foot in my microelectronics room.

phil

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, December 17, 2001 9:59 AM
To: [log in to unmask]
Subject: [TN] Cleaning after plasma


Good morning all.
I am dealing with a very hot manufacturing, er, um... challenge, right now.
On one of our assemblies, we are having a hell of a time getting our
Humiseal 1B31 to stick to the assembly surface (solder mask).  One of the
remedial measures I am trying for work in progress, whilst I work on the
root cause, is to plasma treat the assemblies:  750 mTorr, 100 watts, argon
plasma, 5 minutes.  Our plasma expert does not think these settings will
have detrimental effects on the assembly.  I am also looking at the mask
and other process related possibilities.

Here is my problem, well actually a problem within a problem, anyway....

The plasma cleaner is in our microelectronics clean room.  Depending on
where it is in the process, some of the assemblies have silicone RTV on
them and the microelectronics folks are rightly concerned with silicone
cross contamination.  This cleaner is used for cleaning die prior to
bonding and silicone contamination would be a *big* problem.

The question:  what kind of cleaning protocol would you recommend on a
plasma chamber to get any outgassed products and how would you verify no
cross contamination?

Dow suggests using their OS2 cleaner.  I am inclined to use acetone and
then run an oxygen plasma after that to ash any organics.

Suggestions?

Doug Pauls
Rockwell Collins

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