Greetings,
You can rework any BGA on either side of the board. The baking procedures
must be follow to ensure no moisture is in the packages during the reflow
processes. using the rework station (Air-vac) to remove the BGA, clean all
pads and using mini stencil to reinstall the new BGA ( mini stencil can be
eliminate by using No-Clean flux paste) The best reflow method is using your
 convection oven by placing the board on the rail or off the belt. Placing
the new BGA on top and reflow thru the convection oven and the other on the
bottom. With liquid surface tension of the reflow solder will be more than
enough to hold the bottom BGA in place during reflow. You can inspect for
short with X-ray at 0 degree and openned pins at 75 degree tilt.

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