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December 2001

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Subject:
From:
Kris Keating <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 17 Dec 2001 11:05:01 -0500
Content-Type:
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> -----Original Message-----
> From: jong s kadesch [SMTP:[log in to unmask]]
> Sent: Monday, December 17, 2001 9:58 AM
> To:   [log in to unmask]
> Subject:      [TN] Jong on Vacation (was Re: TechNet Digest - 14 Dec 2001
> - Special issue (#2001-778))
>
> At 02:57 PM 12/14/01 -0600, you wrote:
>
>
>       Date:     Fri, 14 Dec 2001 14:57:26 -0600
>       Reply-To: TechNet <[log in to unmask]>
>       Sender:   TechNet <[log in to unmask]>
>       From:     Automatic digest processor <[log in to unmask]>
>       Subject:  TechNet Digest - 14 Dec 2001 - Special issue (#2001-778)
>       To:       Recipients of TechNet digests <[log in to unmask]>
>
>       There are 12 messages totalling 927 lines in this issue.
>
>       Topics in this special issue:
>
>         1. IPC Supplier Audit Guidelines
>         2. Alumina filled Polysulfide compound... (4)
>         3. EPA TRI reporting of lead usage
>         4. photoplotters (2)
>         5. Homeplate apertures, how to use them (3)
>         6. Alumina filled Polysulfide compound... What Did Charles Say?
>
>
> --------------------------------------------------------------------------
> -------
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> additional
>       information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
>
> --------------------------------------------------------------------------
> -------
>       Date:    Fri, 14 Dec 2001 08:33:41 -0700
>       From:    Rick Howieson <[log in to unmask]>
>       Subject: Re: IPC Supplier Audit Guidelines
>       MIME-Version: 1.0
>       Content-Type: multipart/alternative;
> boundary="----_=_NextPart_001_01C184B4.B57E7D70"
>
>       1710 is more of a supplier profile and not an audit guideline. It
> will give you an idea of what a board shop can accomplish compared to your
> design but does not get into how a fabricator controls their process.
>       Rick
>
>
>
>                       -----Original Message-----
>                       From: Stephen R. Gregory [
> <mailto:[log in to unmask]>]
>                       Sent: Wednesday, December 12, 2001 3:09 PM
>                       To: [log in to unmask]
>                       Subject: Re: [TN] IPC Supplier Audit Guidelines
>
>
>                       Hi Jana,
>
>
>                       Go to www.ipc.org <http://www.ipc.org/>, then click
> on Online Resources and Databases, then scroll all the way down to IPC
> Documents Available for Download and click on that.
>
>
>                       You will find:
>
>
>                       IPC-1710 OEM
>                       Standard for Printed Board Manufacturers'
> Qualification Profile
>
>
>                       Developed by the OEM council of the IPC, the MQP
> sets the standard for assessing PWB manufacturers capabilities and allows
> PWB manufacturers to more easily satisfy customer requirements.
>
>
>                       IPC-1720
>                       Assembly Qualification Profile Developed by the OEM
> council of the IPC, IPC-1720 categorized an electronic assembly
> manufacturer's capabilities and supplies the OEM customer with detailed,
> substantive information.
>
>
>                       IPC-1730A
>                       Laminator Qualifier Profile
>                       Are you a laminate manufacturer looking to provide
> your customers with a consistent, detailed report on your facility(s)?
> IPC-1730A is the one tool laminate manufacturers can use to provide
> current and potential customers with a profile of their facilities. By
> completing this questionnaire, laminators can provide information on
> materials supplied, approvals and certifications, testing available,
> equipment capabilities and more!
>
>
>                       IPC-1731
>                       Strategic Raw Materials Supplier Qualification
> Profile (SRMSQP)
>                       Suppliers of raw materials to laminate manufacture
> now have an industry approved questionaire to supply current and potential
> customers with a self assessment of their facility(s). IPC-1731 gives
> suppliers of raw materials the opportunity to create a profile of their
> manufacturing facility(s) that will be consistent with those developed by
> similar suppliers. Using the MS Word template enables easy creation and
> maintenance of the file(s) and provide their customers with an electronic
> file for their records.
>
>
>                       -Steve Gregory-
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>                       Greetings All,
>
>
>                       I have in the back of my mind, a dusty place indeed,
> that IPC had a document
>                       containing Supplier Audit guidelines.  I have surfed
> the IPC site and do not
>                       find such a document in the Technical Publications
> pdf.  Does IPC have
>                       something like this, or ... I'm losing it!
>                       Thanks for the help,
>                       Jana Carraway
>                       Micro Systems Engineering, Inc.
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>               Date:    Fri, 14 Dec 2001 08:27:33 -0800
>               From:    "Barmuta, Mike" <[log in to unmask]>
>               Subject: Re: Alumina filled Polysulfide compound...
>               MIME-Version: 1.0
>               Content-Type: text/plain; charset="iso-8859-1"
>
>               Steve:
>               Take a look at MIL-S-8516 Sealing Compound, Polysulfide
> Rubber, Electrical
>               Connectors and Electrical Systems, Chemically Cured. I think
> this is more in
>               line with what you are doing than 8802.
>               Polysulfde compounds have been around a long time, however
> for electrical
>               applications I think most have been replaced by urethanes
> and silicones.
>
>
>
>               Good Luck !
>
>               Michael Barmuta
>
>               Staff Engineer
>
>               Fluke Corp.
>
>               Everett  WA
>
>               425-446-6076
>
>
>               -----Original Message-----
>               From: Stephen R. Gregory [ <mailto:[log in to unmask]>]
>               Sent: Friday, December 14, 2001 6:26 AM
>               To: [log in to unmask]
>               Subject: [TN] Alumina filled Polysulfide compound...
>
>
>               Hi All!!
>
>               ....tappity-tappity-tappity...(doin' my thank gawd it's
> Friday dance! hehehe)
>
>
>               I was wondering if someone could point me in a direction
> where I could find
>               some alumina filled polysulfide compound, per MIL-S-8802,
> class A-2, with 50
>               plus or minus 10%, 325 mesh aluminum oxide powder...
>
>               This is something that is called out on a drawing for a
> board that's using
>               this material to strain relief two small battery cables that
> are installed
>               on the board...I've searched and find a bunch of stuff about
> polysulfide
>               compounds, but nothing alumina filled. If I search under
> MIL-S-8802, I find
>               all kinds of polysulfide sealers for jet fuel tanks, but
> still nothing
>               alumina filled...
>
>               Any help will be much appreciated
>
>               -Steve Gregory-
>               Date:    Fri, 14 Dec 2001 11:30:16 -0500
>               From:    Gregg Klawson <[log in to unmask]>
>               Subject: Re: Alumina filled Polysulfide compound...
>               MIME-Version: 1.0
>               Content-Type: text/plain; format=flowed; charset=us-ascii
>
>               Hi Steve,
>
>               You can always buy the alumina powder and polysulfide
> compound separately
>               and mix 'em together.  I've seen this done successfully with
> various
>               adhesive materials, not sure if we ever did it with a
> polysulfide though.
>
>               Good luck,
>               Gregg
>
>               At 09:26 AM 12/14/01, Stephen R. Gregory wrote:
>
>
>                       Hi All!!
>
>                       ...tappity-tappity-tappity...(doin' my thank gawd
> it's Friday dance! hehehe)
>
>                       I was wondering if someone could point me in a
> direction where I could
>                       find some alumina filled polysulfide compound, per
> MIL-S-8802, class A-2,
>                       with 50 plus or minus 10%, 325 mesh aluminum oxide
> powder...
>
>                       This is something that is called out on a drawing
> for a board that's using
>                       this material to strain relief two small battery
> cables that are installed
>                       on the board...I've searched and find a bunch of
> stuff about polysulfide
>                       compounds, but nothing alumina filled. If I search
> under MIL-S-8802, I
>                       find all kinds of polysulfide sealers for jet fuel
> tanks, but still
>                       nothing alumina filled...
>
>                       Any help will be much appreciated
>
>                       -Steve Gregory-
>
>
>
>               Date:    Fri, 14 Dec 2001 11:56:31 -0500
>               From:    Phil Nutting <[log in to unmask]>
>               Subject: EPA TRI reporting of lead usage
>               MIME-Version: 1.0
>               Content-Type: text/plain; charset="iso-8859-1"
>
>               This topic (lead usage and disposal reporting) got bounced
> around
>               several months ago.  I know the IPC has spoken to the
> go'ment about the
>               ramifications this ruling brings and it is my understanding
> that the
>               feds turned a deaf ear to them.  So, to that end, has anyone
> attempted
>               to figure out what we (as small OEMs building electronic
> devices that
>               include circuit boards) are supposed to submit to the feds
> in the way of
>               reporting?  I've attempted to wade through the EPA documents
> and wish
>               there was a "Cliff Notes" version so I can figure out what
> we are
>               supposed to do without having to hire an expensive
> consultant.
>
>               Have I just opened a can of worms?
>
>               Phil Nutting
>               Date:    Fri, 14 Dec 2001 08:58:18 -0800
>               From:    Karla Thompson <[log in to unmask]>
>               Subject: Re: photoplotters
>               MIME-Version: 1.0
>               Content-Type: text/plain; charset="iso-8859-1"
>
>               Thanks for the replies.
>                Anyone have an EIE plotter? Specifically the RP200 line?
>
>
>
>               -----Original Message-----
>               From: Mark Hargreaves [ <mailto:[log in to unmask]>]
>               Sent: Friday, December 14, 2001 04:28
>               To: [log in to unmask]
>               Subject: Re: photoplotters
>
>
>               Hi Karla,
>               We currently have a 3-4 year old CSI (guess it's Gretag now)
> plotter. We're
>               happy with the images, speed and up-time.
>
>               Regards,
>               Mark Hargreaves
>               EMDS
>
>                       -----Original Message-----
>                       From:   Karla Thompson [SMTP:[log in to unmask]]
>                       Sent:   Thursday, December 13, 2001 6:28 PM
>                       To:     [log in to unmask]
>                       Subject:        [TN] photoplotters
>
>                       I'm in the process of looking at Photoplotters and
> would appreciate
>               any
>                       input any of you may have. We currently have a 5-6
> year old Barco
>               Crescent
>                       30.  I'm looking at EIE, Orbotech, and Barco/Mania.
> If any of you
>               have any
>                       comments on those, or any others (?) I'd appreciate
> it.
>
>
>                       Karla Thompson
>                       CAM Technician
>                       Electronic Controls Design, Inc
>                       Tel: (503) 829-9108
>                       email: [log in to unmask]
>
>
>
> --------------------------------------------------------------------------
> --
>               -----
>                       Technet Mail List provided as a free service by IPC
> using LISTSERV
>               1.8d
>                       To unsubscribe, send a message to [log in to unmask]
> with following
>               text in
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> following message:
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>                       Search previous postings at: www.ipc.org
> <http://www.ipc.org/> > On-Line Resources &
>               Databases > E-mail Archives
>                       Please visit IPC web site (
> <http://www.ipc.org/html/forum.htm>) for
>               additional
>                       information, or contact Keach Sasamori at
> [log in to unmask] or
>               847-509-9700 ext.5315
>
>
> --------------------------------------------------------------------------
> --
>               -----
>
>
> --------------------------------------------------------------------------
> --
>               -----
>               Technet Mail List provided as a free service by IPC using
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> 847-509-9700
>               ext.5315
>
> --------------------------------------------------------------------------
> --
>               -----
>               Date:    Fri, 14 Dec 2001 12:45:47 -0500
>               From:    Brock Hunter <[log in to unmask]>
>               Subject: Re: photoplotters
>               MIME-Version: 1.0
>               Content-Type: text/plain; charset=us-ascii
>               Content-Transfer-Encoding: 7bit
>
>               Karla,
>
>               We have an EIE RP-508 and have only been down once in the
> past 14 months. Overall we are quite
>               pleased with it. Initially it was intended to supplement our
> CSI FIRE 9300 and quickly took
>               over all the work, typically 130 - 150 plots ( 24 X 30 ) per
> day.
>
>               Cheers,
>
>               Brock
>
>               Karla Thompson wrote:
>
>               > Thanks for the replies.
>               >  Anyone have an EIE plotter? Specifically the RP200 line?
>               >
>               > -----Original Message-----
>               > From: Mark Hargreaves [ <mailto:[log in to unmask]>]
>               > Sent: Friday, December 14, 2001 04:28
>               > To: [log in to unmask]
>               > Subject: Re: photoplotters
>               >
>               > Hi Karla,
>               > We currently have a 3-4 year old CSI (guess it's Gretag
> now) plotter. We're
>               > happy with the images, speed and up-time.
>               >
>               > Regards,
>               > Mark Hargreaves
>               > EMDS
>               >
>               >         -----Original Message-----
>               >         From:   Karla Thompson [SMTP:[log in to unmask]]
>               >         Sent:   Thursday, December 13, 2001 6:28 PM
>               >         To:     [log in to unmask]
>               >         Subject:        [TN] photoplotters
>               >
>               >         I'm in the process of looking at Photoplotters and
> would appreciate
>               > any
>               >         input any of you may have. We currently have a 5-6
> year old Barco
>               > Crescent
>               >         30.  I'm looking at EIE, Orbotech, and
> Barco/Mania. If any of you
>               > have any
>               >         comments on those, or any others (?) I'd
> appreciate it.
>               >
>               >         Karla Thompson
>               >         CAM Technician
>               >         Electronic Controls Design, Inc
>               >         Tel: (503) 829-9108
>               >         email: [log in to unmask]
>               >
>               >
> --------------------------------------------------------------------------
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>               >         Search previous postings at: www.ipc.org
> <http://www.ipc.org/> > On-Line Resources &
>               > Databases > E-mail Archives
>               >         Please visit IPC web site (
> <http://www.ipc.org/html/forum.htm>) for
>               > additional
>               >         information, or contact Keach Sasamori at
> [log in to unmask] or
>               > 847-509-9700 ext.5315
>               >
>               >
> --------------------------------------------------------------------------
> --
>               > -----
>               >
>               >
> --------------------------------------------------------------------------
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>               > -----
>               > Technet Mail List provided as a free service by IPC using
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> following text in
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>               > information, or contact Keach Sasamori at [log in to unmask]
> or 847-509-9700
>               > ext.5315
>               >
> --------------------------------------------------------------------------
> --
>               > -----
>               >
>               >
> --------------------------------------------------------------------------
> -------
>               > Technet Mail List provided as a free service by IPC using
> LISTSERV 1.8d
>               > To unsubscribe, send a message to [log in to unmask] with
> following text in
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>               > To temporarily halt delivery of Technet send the following
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> <http://www.ipc.org/> > On-Line Resources & Databases > E-mail Archives
>               > Please visit IPC web site (
> <http://www.ipc.org/html/forum.htm>) for additional
>               > information, or contact Keach Sasamori at [log in to unmask]
> or 847-509-9700 ext.5315
>               >
> --------------------------------------------------------------------------
> -------
>
>               --
>               Brock Hunter  [log in to unmask]
>               Engineering Mgr.
>               Dynamic & Proto Circuits
>               TEL (905) 643-9900
>               FAX (905) 643-9437
>               <http://www.dapc.com/>
>               Date:    Fri, 14 Dec 2001 12:56:32 -0500
>               From:    Jeff Seeger <[log in to unmask]>
>               Subject: Re: Homeplate apertures, how to use them
>               MIME-Version: 1.0
>               Content-Type: text/plain; charset=us-ascii
>               Content-Transfer-Encoding: 7bit
>
>               "d. terstegge" wrote:
>               >
>               > snip <
>               > How do others deal with this ?  Mabe you have suggestions
> on how to make an easier-to-use specification ?  Or ideas about easier
> ways to order a stencil according to my spec ?
>
>
>                       Wouldn't this be handled best in design?  That way
> it can
>                       be a part of the footprint and happen "by itself".
>
>                       Most of the dense boards I've seen lately are very
> difficult
>                       to determine which pads relate to each other with
> any degree
>                       of certainty.  Silkscreens are so compromised as to
> not be
>                       reliable indicators.
>
>                       Just a thought,
>               --
>
>                     Jeff Seeger                         Applied CAD
> Knowledge Inc
>                     Chief Technical Officer                  Tyngsboro, MA
> 01879
>                     jseeger "at" appliedcad "dot" com                978
> 649 9800
>               Date:    Fri, 14 Dec 2001 13:17:25 -0600
>               From:    Charles Caswell <[log in to unmask]>
>               Subject: Re: Alumina filled Polysulfide compound...
>               MIME-Version: 1.0
>               Content-Type: text/plain; charset="utf-8"
>
>               Steve, I am at home so I don't have the info here . We use
> the same
>               stuff to bond components on some boards. I don't think you
> will find the
>               stuff already mixed with the AlO2. I couldn't. The
> polysulfide IS fuel
>               tank sealant. We mix it in small batches with approx. equal
> parts of
>               AlO2 and the base material by weight. I wonder if  we have
> the same
>               customer. I will try to get into work tommorow and send some
> info, if
>               not then on Mon. By the way, the stuff stinks.
>               Charles Caswell
>               Process Lead, PCB
>               Frontier Electronic Systems
>
>                       -----Original Message-----
>                       From: Stephen R. Gregory
>                       Sent: Fri 12/14/2001 8:26 AM
>                       To: [log in to unmask]
>                       Cc:
>                       Subject: [TN] Alumina filled Polysulfide compound...
>
>
>                       Hi All!!
>
>                       ...tappity-tappity-tappity...(doin' my thank gawd
> it's Friday
>               dance! hehehe)
>
>                       I was wondering if someone could point me in a
> direction where I
>               could find some alumina filled polysulfide compound, per
> MIL-S-8802,
>               class A-2, with 50 plus or minus 10%, 325 mesh aluminum
> oxide powder...
>
>                       This is something that is called out on a drawing
> for a board
>               that's using this material to strain relief two small
> battery cables
>               that are installed on the board...I've searched and find a
> bunch of
>               stuff about polysulfide compounds, but nothing alumina
> filled. If I
>               search under MIL-S-8802, I find all kinds of polysulfide
> sealers for jet
>               fuel tanks, but still nothing alumina filled...
>
>                       Any help will be much appreciated
>
>                       -Steve Gregory-
>
>               Date:    Fri, 14 Dec 2001 14:38:40 EST
>               From:    "Stephen R. Gregory" <[log in to unmask]>
>               Subject: Re: Alumina filled Polysulfide compound...
>               MIME-Version: 1.0
>               Content-Type: multipart/alternative;
> boundary="part1_16b.5ac614f.294baf40_boundary"
>
>               Hi Charles,
>
>               Sorry, but I didn't understand a word you said...
>
>               -Steve Gregory-
>
>               In a message dated 12/14/01 1:17:12 PM Central Standard
> Time, [log in to unmask] writes:
>
>
>
>
>
> U3RldmUsIEkgYW0gYXQgaG9tZSBzbyBJIGRvbid0IGhhdmUgdGhlIGluZm8gaGVyZSAuIFdlIH
> Vz
>
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>
> bid0IHRoaW5rIHlvdSB3aWxsIGZpbmQgdGhlDQpzdHVmZiBhbHJlYWR5IG1peGVkIHdpdGggdG
> hl
>
> IEFsTzIuIEkgY291bGRuJ3QuIFRoZSBwb2x5c3VsZmlkZSBJUyBmdWVsDQp0YW5rIHNlYWxhbn
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> 0K
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>
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>
>
>
>               Date:    Fri, 14 Dec 2001 21:24:28 +0100
>               From:    "D.Terstegge" <[log in to unmask]>
>               Subject: Re: Homeplate apertures, how to use them
>               MIME-Version: 1.0
>               Content-Type: multipart/alternative;
> boundary="----=_NextPart_000_0068_01C184E5.B6848580"
>
>               I agree, but for subcontracting that's a situation that I
> can only dream of. The reality is that you get Gerber data (one to one
> with the pads) that you need to edit yourself, or you need to make clear
> instructions for the company that makes the stencils so they can do the
> Gerber-editing.
>
>               Daan Terstegge
>
>
>
>               ----- Original Message -----
>
>                       From: Jeff Seeger <mailto:[log in to unmask]>
>                       To: [log in to unmask] <mailto:[log in to unmask]>
>                       Sent: Friday, December 14, 2001 6:56 PM
>                       Subject: Re: [TN] Homeplate apertures, how to use
> them
>
>
>                       "d. terstegge" wrote:
>                       >
>                       > snip <
>                       > How do others deal with this ?  Mabe you have
> suggestions on how to make an easier-to-use specification ?  Or ideas
> about easier ways to order a stencil according to my spec ?
>
>
>
>
>                               Wouldn't this be handled best in design?
> That way it can
>                               be a part of the footprint and happen "by
> itself".
>
>
>                               Most of the dense boards I've seen lately
> are very difficult
>                               to determine which pads relate to each other
> with any degree
>                               of certainty.  Silkscreens are so
> compromised as to not be
>                               reliable indicators.
>
>
>                               Just a thought,
>                       --
>
>
>                             Jeff Seeger                         Applied
> CAD Knowledge Inc
>                             Chief Technical Officer
> Tyngsboro, MA  01879
>                             jseeger "at" appliedcad "dot" com
> 978 649 9800
>
>
>
> --------------------------------------------------------------------------
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> --------------------------------------------------------------------------
> -------
>
>
>
>               Date:    Fri, 14 Dec 2001 14:46:45 -0600
>               From:    Earl Moon <[log in to unmask]>
>               Subject: Re: Homeplate apertures, how to use them
>
>               Some things you can do include editing Gerber (dumb xy data)
> or ODB++
>               (intellegent) data using a CAM package as Valor. This
> package, as an
>               example, provides clearly identifiable graphic information
> concerning pads,
>               with special features, and their locations. All this is
> provided you have
>               built in design rules as ERF's (external reference files).
>
>               Also, if the stencil maker is using a similar package it may
> easily
>               translate requirements into an AOI system. If so, AOI is an
> answer I've used
>               many times, when applicable. Don't know why this isn't done
> more. Asked this
>               group some time back but no responses.
>
>               MoonMan
>               Date:    Fri, 14 Dec 2001 16:04:03 EST
>               From:    "Stephen R. Gregory" <[log in to unmask]>
>               Subject: Re: Alumina filled Polysulfide compound... What Did
> Charles Say?
>               MIME-Version: 1.0
>               Content-Type: multipart/alternative;
> boundary="part1_147.65a01ae.294bc343_boundary"
>
>               Thanks Gary, Genny, and Dave!
>
>               I wonder why I got Charles email all garbled like that? I
> get those every once in a while...I was attributing it before to the email
> being sent using a foreign language character set, obviously that wasn't
> the case if all of you could read it...strange stuff?
>
>               Thanks again, and thank you Charles!
>
>               -Steve Gregory-
>
>               P.S. Charles, I would appreciate it if you would send me the
> info you have...next   week would be fine, and most appreciated! Also, I
> don't think we have the same customer...
>
>               In a message dated 12/14/01 2:19:37 PM Central Standard
> Time, [log in to unmask],
>               [log in to unmask], and [log in to unmask] writes:
>
>
>
>
>                       From: "Charles Caswell" < [log in to unmask]
> <mailto:[log in to unmask]>>
>                       Subject:      Re: [TN] Alumina filled Polysulfide
> compound...
>                       Date: Friday, December 14, 2001 11:28 AM
>
>                       Steve, I am at home so I don't have the info here .
> We use the same stuff to bond components on some boards. I don't think you
> will find the stuff already mixed with the AlO2. I couldn't. The
> polysulfide IS fuel tank sealant. We mix it in small batches with approx.
> equal parts of AlO2 and the base material by weight. I wonder if  we have
> the same customer. I will try to get into work tommorow and send some
> info, if not then on Mon. By the way, the stuff stinks.
>                       Charles Caswell
>
>
>
>
>       Hi,
>
>       I will be back on 12/17/01.
>
>       Regards,
>       Jong
>
>

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