> -----Original Message-----
> From: jong s kadesch [SMTP:[log in to unmask]]
> Sent: Monday, December 17, 2001 9:58 AM
> To: [log in to unmask]
> Subject: [TN] Jong on Vacation (was Re: TechNet Digest - 14 Dec 2001
> - Special issue (#2001-778))
>
> At 02:57 PM 12/14/01 -0600, you wrote:
>
>
> Date: Fri, 14 Dec 2001 14:57:26 -0600
> Reply-To: TechNet <[log in to unmask]>
> Sender: TechNet <[log in to unmask]>
> From: Automatic digest processor <[log in to unmask]>
> Subject: TechNet Digest - 14 Dec 2001 - Special issue (#2001-778)
> To: Recipients of TechNet digests <[log in to unmask]>
>
> There are 12 messages totalling 927 lines in this issue.
>
> Topics in this special issue:
>
> 1. IPC Supplier Audit Guidelines
> 2. Alumina filled Polysulfide compound... (4)
> 3. EPA TRI reporting of lead usage
> 4. photoplotters (2)
> 5. Homeplate apertures, how to use them (3)
> 6. Alumina filled Polysulfide compound... What Did Charles Say?
>
>
> --------------------------------------------------------------------------
> -------
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>
> --------------------------------------------------------------------------
> -------
> Date: Fri, 14 Dec 2001 08:33:41 -0700
> From: Rick Howieson <[log in to unmask]>
> Subject: Re: IPC Supplier Audit Guidelines
> MIME-Version: 1.0
> Content-Type: multipart/alternative;
> boundary="----_=_NextPart_001_01C184B4.B57E7D70"
>
> 1710 is more of a supplier profile and not an audit guideline. It
> will give you an idea of what a board shop can accomplish compared to your
> design but does not get into how a fabricator controls their process.
> Rick
>
>
>
> -----Original Message-----
> From: Stephen R. Gregory [
> <mailto:[log in to unmask]>]
> Sent: Wednesday, December 12, 2001 3:09 PM
> To: [log in to unmask]
> Subject: Re: [TN] IPC Supplier Audit Guidelines
>
>
> Hi Jana,
>
>
> Go to www.ipc.org <http://www.ipc.org/>, then click
> on Online Resources and Databases, then scroll all the way down to IPC
> Documents Available for Download and click on that.
>
>
> You will find:
>
>
> IPC-1710 OEM
> Standard for Printed Board Manufacturers'
> Qualification Profile
>
>
> Developed by the OEM council of the IPC, the MQP
> sets the standard for assessing PWB manufacturers capabilities and allows
> PWB manufacturers to more easily satisfy customer requirements.
>
>
> IPC-1720
> Assembly Qualification Profile Developed by the OEM
> council of the IPC, IPC-1720 categorized an electronic assembly
> manufacturer's capabilities and supplies the OEM customer with detailed,
> substantive information.
>
>
> IPC-1730A
> Laminator Qualifier Profile
> Are you a laminate manufacturer looking to provide
> your customers with a consistent, detailed report on your facility(s)?
> IPC-1730A is the one tool laminate manufacturers can use to provide
> current and potential customers with a profile of their facilities. By
> completing this questionnaire, laminators can provide information on
> materials supplied, approvals and certifications, testing available,
> equipment capabilities and more!
>
>
> IPC-1731
> Strategic Raw Materials Supplier Qualification
> Profile (SRMSQP)
> Suppliers of raw materials to laminate manufacture
> now have an industry approved questionaire to supply current and potential
> customers with a self assessment of their facility(s). IPC-1731 gives
> suppliers of raw materials the opportunity to create a profile of their
> manufacturing facility(s) that will be consistent with those developed by
> similar suppliers. Using the MS Word template enables easy creation and
> maintenance of the file(s) and provide their customers with an electronic
> file for their records.
>
>
> -Steve Gregory-
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
> Greetings All,
>
>
> I have in the back of my mind, a dusty place indeed,
> that IPC had a document
> containing Supplier Audit guidelines. I have surfed
> the IPC site and do not
> find such a document in the Technical Publications
> pdf. Does IPC have
> something like this, or ... I'm losing it!
> Thanks for the help,
> Jana Carraway
> Micro Systems Engineering, Inc.
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
> Date: Fri, 14 Dec 2001 08:27:33 -0800
> From: "Barmuta, Mike" <[log in to unmask]>
> Subject: Re: Alumina filled Polysulfide compound...
> MIME-Version: 1.0
> Content-Type: text/plain; charset="iso-8859-1"
>
> Steve:
> Take a look at MIL-S-8516 Sealing Compound, Polysulfide
> Rubber, Electrical
> Connectors and Electrical Systems, Chemically Cured. I think
> this is more in
> line with what you are doing than 8802.
> Polysulfde compounds have been around a long time, however
> for electrical
> applications I think most have been replaced by urethanes
> and silicones.
>
>
>
> Good Luck !
>
> Michael Barmuta
>
> Staff Engineer
>
> Fluke Corp.
>
> Everett WA
>
> 425-446-6076
>
>
> -----Original Message-----
> From: Stephen R. Gregory [ <mailto:[log in to unmask]>]
> Sent: Friday, December 14, 2001 6:26 AM
> To: [log in to unmask]
> Subject: [TN] Alumina filled Polysulfide compound...
>
>
> Hi All!!
>
> ....tappity-tappity-tappity...(doin' my thank gawd it's
> Friday dance! hehehe)
>
>
> I was wondering if someone could point me in a direction
> where I could find
> some alumina filled polysulfide compound, per MIL-S-8802,
> class A-2, with 50
> plus or minus 10%, 325 mesh aluminum oxide powder...
>
> This is something that is called out on a drawing for a
> board that's using
> this material to strain relief two small battery cables that
> are installed
> on the board...I've searched and find a bunch of stuff about
> polysulfide
> compounds, but nothing alumina filled. If I search under
> MIL-S-8802, I find
> all kinds of polysulfide sealers for jet fuel tanks, but
> still nothing
> alumina filled...
>
> Any help will be much appreciated
>
> -Steve Gregory-
> Date: Fri, 14 Dec 2001 11:30:16 -0500
> From: Gregg Klawson <[log in to unmask]>
> Subject: Re: Alumina filled Polysulfide compound...
> MIME-Version: 1.0
> Content-Type: text/plain; format=flowed; charset=us-ascii
>
> Hi Steve,
>
> You can always buy the alumina powder and polysulfide
> compound separately
> and mix 'em together. I've seen this done successfully with
> various
> adhesive materials, not sure if we ever did it with a
> polysulfide though.
>
> Good luck,
> Gregg
>
> At 09:26 AM 12/14/01, Stephen R. Gregory wrote:
>
>
> Hi All!!
>
> ...tappity-tappity-tappity...(doin' my thank gawd
> it's Friday dance! hehehe)
>
> I was wondering if someone could point me in a
> direction where I could
> find some alumina filled polysulfide compound, per
> MIL-S-8802, class A-2,
> with 50 plus or minus 10%, 325 mesh aluminum oxide
> powder...
>
> This is something that is called out on a drawing
> for a board that's using
> this material to strain relief two small battery
> cables that are installed
> on the board...I've searched and find a bunch of
> stuff about polysulfide
> compounds, but nothing alumina filled. If I search
> under MIL-S-8802, I
> find all kinds of polysulfide sealers for jet fuel
> tanks, but still
> nothing alumina filled...
>
> Any help will be much appreciated
>
> -Steve Gregory-
>
>
>
> Date: Fri, 14 Dec 2001 11:56:31 -0500
> From: Phil Nutting <[log in to unmask]>
> Subject: EPA TRI reporting of lead usage
> MIME-Version: 1.0
> Content-Type: text/plain; charset="iso-8859-1"
>
> This topic (lead usage and disposal reporting) got bounced
> around
> several months ago. I know the IPC has spoken to the
> go'ment about the
> ramifications this ruling brings and it is my understanding
> that the
> feds turned a deaf ear to them. So, to that end, has anyone
> attempted
> to figure out what we (as small OEMs building electronic
> devices that
> include circuit boards) are supposed to submit to the feds
> in the way of
> reporting? I've attempted to wade through the EPA documents
> and wish
> there was a "Cliff Notes" version so I can figure out what
> we are
> supposed to do without having to hire an expensive
> consultant.
>
> Have I just opened a can of worms?
>
> Phil Nutting
> Date: Fri, 14 Dec 2001 08:58:18 -0800
> From: Karla Thompson <[log in to unmask]>
> Subject: Re: photoplotters
> MIME-Version: 1.0
> Content-Type: text/plain; charset="iso-8859-1"
>
> Thanks for the replies.
> Anyone have an EIE plotter? Specifically the RP200 line?
>
>
>
> -----Original Message-----
> From: Mark Hargreaves [ <mailto:[log in to unmask]>]
> Sent: Friday, December 14, 2001 04:28
> To: [log in to unmask]
> Subject: Re: photoplotters
>
>
> Hi Karla,
> We currently have a 3-4 year old CSI (guess it's Gretag now)
> plotter. We're
> happy with the images, speed and up-time.
>
> Regards,
> Mark Hargreaves
> EMDS
>
> -----Original Message-----
> From: Karla Thompson [SMTP:[log in to unmask]]
> Sent: Thursday, December 13, 2001 6:28 PM
> To: [log in to unmask]
> Subject: [TN] photoplotters
>
> I'm in the process of looking at Photoplotters and
> would appreciate
> any
> input any of you may have. We currently have a 5-6
> year old Barco
> Crescent
> 30. I'm looking at EIE, Orbotech, and Barco/Mania.
> If any of you
> have any
> comments on those, or any others (?) I'd appreciate
> it.
>
>
> Karla Thompson
> CAM Technician
> Electronic Controls Design, Inc
> Tel: (503) 829-9108
> email: [log in to unmask]
>
>
>
> --------------------------------------------------------------------------
> --
> -----
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>
> --------------------------------------------------------------------------
> --
> -----
> Date: Fri, 14 Dec 2001 12:45:47 -0500
> From: Brock Hunter <[log in to unmask]>
> Subject: Re: photoplotters
> MIME-Version: 1.0
> Content-Type: text/plain; charset=us-ascii
> Content-Transfer-Encoding: 7bit
>
> Karla,
>
> We have an EIE RP-508 and have only been down once in the
> past 14 months. Overall we are quite
> pleased with it. Initially it was intended to supplement our
> CSI FIRE 9300 and quickly took
> over all the work, typically 130 - 150 plots ( 24 X 30 ) per
> day.
>
> Cheers,
>
> Brock
>
> Karla Thompson wrote:
>
> > Thanks for the replies.
> > Anyone have an EIE plotter? Specifically the RP200 line?
> >
> > -----Original Message-----
> > From: Mark Hargreaves [ <mailto:[log in to unmask]>]
> > Sent: Friday, December 14, 2001 04:28
> > To: [log in to unmask]
> > Subject: Re: photoplotters
> >
> > Hi Karla,
> > We currently have a 3-4 year old CSI (guess it's Gretag
> now) plotter. We're
> > happy with the images, speed and up-time.
> >
> > Regards,
> > Mark Hargreaves
> > EMDS
> >
> > -----Original Message-----
> > From: Karla Thompson [SMTP:[log in to unmask]]
> > Sent: Thursday, December 13, 2001 6:28 PM
> > To: [log in to unmask]
> > Subject: [TN] photoplotters
> >
> > I'm in the process of looking at Photoplotters and
> would appreciate
> > any
> > input any of you may have. We currently have a 5-6
> year old Barco
> > Crescent
> > 30. I'm looking at EIE, Orbotech, and
> Barco/Mania. If any of you
> > have any
> > comments on those, or any others (?) I'd
> appreciate it.
> >
> > Karla Thompson
> > CAM Technician
> > Electronic Controls Design, Inc
> > Tel: (503) 829-9108
> > email: [log in to unmask]
> >
> >
> --------------------------------------------------------------------------
> --
> > -----
> > Technet Mail List provided as a free service by
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> > 1.8d
> > To unsubscribe, send a message to [log in to unmask]
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> > text in
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> > To temporarily halt delivery of Technet send the
> following message:
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> > Search previous postings at: www.ipc.org
> <http://www.ipc.org/> > On-Line Resources &
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> > Please visit IPC web site (
> <http://www.ipc.org/html/forum.htm>) for
> > additional
> > information, or contact Keach Sasamori at
> [log in to unmask] or
> > 847-509-9700 ext.5315
> >
> >
> --------------------------------------------------------------------------
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> >
> >
> --------------------------------------------------------------------------
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> <http://www.ipc.org/> > On-Line Resources & Databases >
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> > Please visit IPC web site (
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> > ext.5315
> >
> --------------------------------------------------------------------------
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> >
> >
> --------------------------------------------------------------------------
> -------
> > Technet Mail List provided as a free service by IPC using
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> > information, or contact Keach Sasamori at [log in to unmask]
> or 847-509-9700 ext.5315
> >
> --------------------------------------------------------------------------
> -------
>
> --
> Brock Hunter [log in to unmask]
> Engineering Mgr.
> Dynamic & Proto Circuits
> TEL (905) 643-9900
> FAX (905) 643-9437
> <http://www.dapc.com/>
> Date: Fri, 14 Dec 2001 12:56:32 -0500
> From: Jeff Seeger <[log in to unmask]>
> Subject: Re: Homeplate apertures, how to use them
> MIME-Version: 1.0
> Content-Type: text/plain; charset=us-ascii
> Content-Transfer-Encoding: 7bit
>
> "d. terstegge" wrote:
> >
> > snip <
> > How do others deal with this ? Mabe you have suggestions
> on how to make an easier-to-use specification ? Or ideas about easier
> ways to order a stencil according to my spec ?
>
>
> Wouldn't this be handled best in design? That way
> it can
> be a part of the footprint and happen "by itself".
>
> Most of the dense boards I've seen lately are very
> difficult
> to determine which pads relate to each other with
> any degree
> of certainty. Silkscreens are so compromised as to
> not be
> reliable indicators.
>
> Just a thought,
> --
>
> Jeff Seeger Applied CAD
> Knowledge Inc
> Chief Technical Officer Tyngsboro, MA
> 01879
> jseeger "at" appliedcad "dot" com 978
> 649 9800
> Date: Fri, 14 Dec 2001 13:17:25 -0600
> From: Charles Caswell <[log in to unmask]>
> Subject: Re: Alumina filled Polysulfide compound...
> MIME-Version: 1.0
> Content-Type: text/plain; charset="utf-8"
>
> Steve, I am at home so I don't have the info here . We use
> the same
> stuff to bond components on some boards. I don't think you
> will find the
> stuff already mixed with the AlO2. I couldn't. The
> polysulfide IS fuel
> tank sealant. We mix it in small batches with approx. equal
> parts of
> AlO2 and the base material by weight. I wonder if we have
> the same
> customer. I will try to get into work tommorow and send some
> info, if
> not then on Mon. By the way, the stuff stinks.
> Charles Caswell
> Process Lead, PCB
> Frontier Electronic Systems
>
> -----Original Message-----
> From: Stephen R. Gregory
> Sent: Fri 12/14/2001 8:26 AM
> To: [log in to unmask]
> Cc:
> Subject: [TN] Alumina filled Polysulfide compound...
>
>
> Hi All!!
>
> ...tappity-tappity-tappity...(doin' my thank gawd
> it's Friday
> dance! hehehe)
>
> I was wondering if someone could point me in a
> direction where I
> could find some alumina filled polysulfide compound, per
> MIL-S-8802,
> class A-2, with 50 plus or minus 10%, 325 mesh aluminum
> oxide powder...
>
> This is something that is called out on a drawing
> for a board
> that's using this material to strain relief two small
> battery cables
> that are installed on the board...I've searched and find a
> bunch of
> stuff about polysulfide compounds, but nothing alumina
> filled. If I
> search under MIL-S-8802, I find all kinds of polysulfide
> sealers for jet
> fuel tanks, but still nothing alumina filled...
>
> Any help will be much appreciated
>
> -Steve Gregory-
>
> Date: Fri, 14 Dec 2001 14:38:40 EST
> From: "Stephen R. Gregory" <[log in to unmask]>
> Subject: Re: Alumina filled Polysulfide compound...
> MIME-Version: 1.0
> Content-Type: multipart/alternative;
> boundary="part1_16b.5ac614f.294baf40_boundary"
>
> Hi Charles,
>
> Sorry, but I didn't understand a word you said...
>
> -Steve Gregory-
>
> In a message dated 12/14/01 1:17:12 PM Central Standard
> Time, [log in to unmask] writes:
>
>
>
>
>
> U3RldmUsIEkgYW0gYXQgaG9tZSBzbyBJIGRvbid0IGhhdmUgdGhlIGluZm8gaGVyZSAuIFdlIH
> Vz
>
> ZSB0aGUgc2FtZQ0Kc3R1ZmYgdG8gYm9uZCBjb21wb25lbnRzIG9uIHNvbWUgYm9hcmRzLiBJIG
> Rv
>
> bid0IHRoaW5rIHlvdSB3aWxsIGZpbmQgdGhlDQpzdHVmZiBhbHJlYWR5IG1peGVkIHdpdGggdG
> hl
>
> IEFsTzIuIEkgY291bGRuJ3QuIFRoZSBwb2x5c3VsZmlkZSBJUyBmdWVsDQp0YW5rIHNlYWxhbn
> Qu
>
> IFdlIG1peCBpdCBpbiBzbWFsbCBiYXRjaGVzIHdpdGggYXBwcm94LiBlcXVhbCBwYXJ0cyBvZg
> 0K
>
> QWxPMiBhbmQgdGhlIGJhc2UgbWF0ZXJpYWwgYnkgd2VpZ2h0LiBJIHdvbmRlciBpZiAgd2UgaG
> F2
>
> ZSB0aGUgc2FtZQ0KY3VzdG9tZXIuIEkgd2lsbCB0cnkgdG8gZ2V0IGludG8gd29yayB0b21tb3
> Jv
>
> dyBhbmQgc2VuZCBzb21lIGluZm8sIGlmDQpub3QgdGhlbiBvbiBNb24uIEJ5IHRoZSB3YXksIH
> Ro
>
> ZSBzdHVmZiBzdGlua3MuDQpDaGFybGVzIENhc3dlbGwNClByb2Nlc3MgTGVhZCwgUENCDQpGcm
> 9u
>
> dGllciBFbGVjdHJvbmljIFN5c3RlbXMNCg0KCS0tLS0tT3JpZ2luYWwgTWVzc2FnZS0tLS0tIA
> 0K
>
> CUZyb206IFN0ZXBoZW4gUi4gR3JlZ29yeSANCglTZW50OiBGcmkgMTIvMTQvMjAwMSA4OjI2IE
> FN
>
> IA0KCVRvOiBUZWNoTmV0QElQQy5PUkcgDQoJQ2M6IA0KCVN1YmplY3Q6IFtUTl0gQWx1bWluYS
> Bm
>
> aWxsZWQgUG9seXN1bGZpZGUgY29tcG91bmQuLi4NCgkNCgkNCglIaSBBbGwhISANCgkNCgkuLi
> 50
>
> YXBwaXR5LXRhcHBpdHktdGFwcGl0eS4uLihkb2luJyBteSB0aGFuayBnYXdkIGl0J3MgRnJpZG
> F5
>
> DQpkYW5jZSEgaGVoZWhlKSANCgkNCglJIHdhcyB3b25kZXJpbmcgaWYgc29tZW9uZSBjb3VsZC
> Bw
>
> b2ludCBtZSBpbiBhIGRpcmVjdGlvbiB3aGVyZSBJDQpjb3VsZCBmaW5kIHNvbWUgYWx1bWluYS
> Bm
>
> aWxsZWQgcG9seXN1bGZpZGUgY29tcG91bmQsIHBlciBNSUwtUy04ODAyLA0KY2xhc3MgQS0yLC
> B3
>
> aXRoIDUwIHBsdXMgb3IgbWludXMgMTAlLCAzMjUgbWVzaCBhbHVtaW51bSBveGlkZSBwb3dkZX
> Iu
>
> Li4gDQoJDQoJVGhpcyBpcyBzb21ldGhpbmcgdGhhdCBpcyBjYWxsZWQgb3V0IG9uIGEgZHJhd2
> lu
>
> ZyBmb3IgYSBib2FyZA0KdGhhdCdzIHVzaW5nIHRoaXMgbWF0ZXJpYWwgdG8gc3RyYWluIHJlbG
> ll
>
> ZiB0d28gc21hbGwgYmF0dGVyeSBjYWJsZXMNCnRoYXQgYXJlIGluc3RhbGxlZCBvbiB0aGUgYm
> 9h
>
> cmQuLi5JJ3ZlIHNlYXJjaGVkIGFuZCBmaW5kIGEgYnVuY2ggb2YNCnN0dWZmIGFib3V0IHBvbH
> lz
>
> dWxmaWRlIGNvbXBvdW5kcywgYnV0IG5vdGhpbmcgYWx1bWluYSBmaWxsZWQuIElmIEkNCnNlYX
> Jj
>
> aCB1bmRlciBNSUwtUy04ODAyLCBJIGZpbmQgYWxsIGtpbmRzIG9mIHBvbHlzdWxmaWRlIHNlYW
> xl
>
> cnMgZm9yIGpldA0KZnVlbCB0YW5rcywgYnV0IHN0aWxsIG5vdGhpbmcgYWx1bWluYSBmaWxsZW
> Qu
>
> Li4gDQoJDQoJQW55IGhlbHAgd2lsbCBiZSBtdWNoIGFwcHJlY2lhdGVkIA0KCQ0KCS1TdGV2ZS
> BH
> cmVnb3J5LSANCgkNCg0K
>
>
>
> Date: Fri, 14 Dec 2001 21:24:28 +0100
> From: "D.Terstegge" <[log in to unmask]>
> Subject: Re: Homeplate apertures, how to use them
> MIME-Version: 1.0
> Content-Type: multipart/alternative;
> boundary="----=_NextPart_000_0068_01C184E5.B6848580"
>
> I agree, but for subcontracting that's a situation that I
> can only dream of. The reality is that you get Gerber data (one to one
> with the pads) that you need to edit yourself, or you need to make clear
> instructions for the company that makes the stencils so they can do the
> Gerber-editing.
>
> Daan Terstegge
>
>
>
> ----- Original Message -----
>
> From: Jeff Seeger <mailto:[log in to unmask]>
> To: [log in to unmask] <mailto:[log in to unmask]>
> Sent: Friday, December 14, 2001 6:56 PM
> Subject: Re: [TN] Homeplate apertures, how to use
> them
>
>
> "d. terstegge" wrote:
> >
> > snip <
> > How do others deal with this ? Mabe you have
> suggestions on how to make an easier-to-use specification ? Or ideas
> about easier ways to order a stencil according to my spec ?
>
>
>
>
> Wouldn't this be handled best in design?
> That way it can
> be a part of the footprint and happen "by
> itself".
>
>
> Most of the dense boards I've seen lately
> are very difficult
> to determine which pads relate to each other
> with any degree
> of certainty. Silkscreens are so
> compromised as to not be
> reliable indicators.
>
>
> Just a thought,
> --
>
>
> Jeff Seeger Applied
> CAD Knowledge Inc
> Chief Technical Officer
> Tyngsboro, MA 01879
> jseeger "at" appliedcad "dot" com
> 978 649 9800
>
>
>
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>
>
> Date: Fri, 14 Dec 2001 14:46:45 -0600
> From: Earl Moon <[log in to unmask]>
> Subject: Re: Homeplate apertures, how to use them
>
> Some things you can do include editing Gerber (dumb xy data)
> or ODB++
> (intellegent) data using a CAM package as Valor. This
> package, as an
> example, provides clearly identifiable graphic information
> concerning pads,
> with special features, and their locations. All this is
> provided you have
> built in design rules as ERF's (external reference files).
>
> Also, if the stencil maker is using a similar package it may
> easily
> translate requirements into an AOI system. If so, AOI is an
> answer I've used
> many times, when applicable. Don't know why this isn't done
> more. Asked this
> group some time back but no responses.
>
> MoonMan
> Date: Fri, 14 Dec 2001 16:04:03 EST
> From: "Stephen R. Gregory" <[log in to unmask]>
> Subject: Re: Alumina filled Polysulfide compound... What Did
> Charles Say?
> MIME-Version: 1.0
> Content-Type: multipart/alternative;
> boundary="part1_147.65a01ae.294bc343_boundary"
>
> Thanks Gary, Genny, and Dave!
>
> I wonder why I got Charles email all garbled like that? I
> get those every once in a while...I was attributing it before to the email
> being sent using a foreign language character set, obviously that wasn't
> the case if all of you could read it...strange stuff?
>
> Thanks again, and thank you Charles!
>
> -Steve Gregory-
>
> P.S. Charles, I would appreciate it if you would send me the
> info you have...next week would be fine, and most appreciated! Also, I
> don't think we have the same customer...
>
> In a message dated 12/14/01 2:19:37 PM Central Standard
> Time, [log in to unmask],
> [log in to unmask], and [log in to unmask] writes:
>
>
>
>
> From: "Charles Caswell" < [log in to unmask]
> <mailto:[log in to unmask]>>
> Subject: Re: [TN] Alumina filled Polysulfide
> compound...
> Date: Friday, December 14, 2001 11:28 AM
>
> Steve, I am at home so I don't have the info here .
> We use the same stuff to bond components on some boards. I don't think you
> will find the stuff already mixed with the AlO2. I couldn't. The
> polysulfide IS fuel tank sealant. We mix it in small batches with approx.
> equal parts of AlO2 and the base material by weight. I wonder if we have
> the same customer. I will try to get into work tommorow and send some
> info, if not then on Mon. By the way, the stuff stinks.
> Charles Caswell
>
>
>
>
> Hi,
>
> I will be back on 12/17/01.
>
> Regards,
> Jong
>
>
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