Dear Keach,
Could you be so kind and disconnect Mr Jong untill he is back from his
vacations???
Edward
> -----Original Message-----
> From: jong s kadesch [SMTP:[log in to unmask]]
> Sent: ב דצמבר 17 2001 16:58
> To: [log in to unmask]
> Subject: [TN] Jong on Vacation (was Re: TechNet Digest - 13 Dec 2001
> (#2001-776))
>
> At 12:00 AM 12/14/01 -0600, you wrote:
>
> Date: Fri, 14 Dec 2001 00:00:04 -0600
> Reply-To: TechNet <[log in to unmask]>
> Sender: TechNet <[log in to unmask]>
> From: Automatic digest processor <[log in to unmask]>
> Subject: TechNet Digest - 13 Dec 2001 (#2001-776)
> To: Recipients of TechNet digests <[log in to unmask]>
>
> There are 8 messages totalling 516 lines in this issue.
>
> Topics of the day:
>
> 1. porosity of gold plating on nickel (2)
> 2. Inefficient solder on Toshiba micro BGA (2)
> 3. .050 PWB (2)
> 4. PCB Density Study/Design Quoting
> 5. photoplotters
>
>
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>
> --------------------------------------------------------------------------
> -------
> Date: Thu, 13 Dec 2001 15:30:15 -0500
> From: "Vandendolder, Ron" <[log in to unmask]>
> Subject: Re: porosity of gold plating on nickel
> MIME-Version: 1.0
> Content-Type: text/plain; charset="iso-8859-1"
>
> Kris,
>
> Although not quantitative, I was impressed with some SEM's (Scanning
> Electron Microscope)
> pictures taken of some gold plated Duroid boards that were not
> performing as
> expected. The pictures showed globular deposits of gold on the top
> surface.
> Where the globular deposits didn't
> touch, nickel was clearly showing.
>
> Ron VandenDolder
> Product Development Group
> Telaxis Communications
> SouthDeerfield, MA
> 413-665-8551
>
> -----Original Message-----
> From: Kris Keating [ <mailto:[log in to unmask]>]
> Sent: Thursday, December 13, 2001 2:31 PM
> To: [log in to unmask]
> Subject: [TN] porosity of gold plating on nickel
>
>
> Does anyone know of a fairly simple method of determining porosity
> of gold
> plating over nickel on a PCB?
>
>
> Kristopher J. Keating
> Technical Service Engineer
> Circuit-Wise, Inc.
> 400 Sackett Point Rd.
> North Haven, CT 06473
> Tel. (203) 281-6511
> Fax (203) 287-8409
>
>
> --------------------------------------------------------------------------
> --
> -----
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> On-Line Resources & Databases >
> E-mail Archives
> Please visit IPC web site ( <http://www.ipc.org/html/forum.htm>) for
> additional
> information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700
> ext.5315
>
> --------------------------------------------------------------------------
> --
> -----
> Date: Thu, 13 Dec 2001 13:44:57 -0700
> From: Steve Abrahamson <[log in to unmask]>
> Subject: Re: Inefficient solder on Toshiba micro BGA
>
> Hey Stacy,
>
> It sounds as though on paper, your process is OK. Just to fill you
> in on
> aspect ratio, that is aperture width/stencil thickness. This is a
> good rule
> of thumb for rectangular apertures such as for fine pitch
> components. For
> small circular or square apertures most people use the area aspect
> ratio
> which is aperture area/wall area. The area aspect ratio should be
> above
> ..66. Thus on a .005" thick stencil with a .0135" square aperture
> you are
> looking at (.0135*.0135)/((.0135*.005)*4) = .675.
> Actually the area aspect ratio for a .0135" round aperture is the
> same as
> that for a square aperture, yet release on the square aperture has
> generally
> been proven to be better (don't forget a .002" or .003" radius on
> the
> corners).
>
> Anyway my point was going to be that I had the exact same apertures
> ordered
> on one particular project, and the apertures all clogged up (luckily
> we
> caught them at the visual step). It seems the apertures were
> severely
> undersized (more like .0122" x .0122"). So are your apertures
> really
> ..0135"?
>
> As Kathy mentioned, kneed or condition your paste. The paste may
> take a few
> prints to fully mix and provide the thixotropic characteristics that
> you
> want. We use a dummy board for the first print, and then print our
> first
> production board.
>
> Personally I think you could get away with a .015" aperture if you
> are
> dealing with a .0315" pitch product. Even if they undercut your
> stencil,
> you should be fine.
>
> Good luck....
>
> Steve A
>
>
> > -----Original Message-----
> > From: My Nguyen [SMTP:[log in to unmask]]
> > Sent: Tuesday,December 11,2001 11:43 AM
> > To: [log in to unmask]
> > Subject: [TN] Inefficient solder on Toshiba micro BGA
> >
> > Hello all,
> >
> > Problem description:
> >
> > Been happening on Rambus - part number tc59rm81xmb.
> > Ball diametter: 0.5 mm; ball pitch: 0.8 mm, ball
> > height: 0.4 mm. Pad size: 0.3 mm (11.5 mils)
> > 5-10% of the time (we run huge amount of them) failure
> > modules came from opening soder join or no solder join
> > at all. As we inspect the screen printing process (we
> > use 5 mils stencil - Dek screenprinting, cleaning
> > rate: 2 per print, cleaning cycle Wet-Vacuum/Dry), we
> > found un-event solder deposit. Some pad even has very
> > little solder or no solder at all.
> >
> > Stencil is electro-polish; Diamond shape aperture,
> > 13.5 mils open used trapezoid shape.
> >
> > We afraid that if we open the apperture bigger, then
> > we may have bridging or solder ball. If we reduce the
> > stencil to 4 mils to reduce the blockage or
> > resistance, then we may have in-efficient solder or
> > many other problem relating thin stencil (damage,
> > short-life, etc)
> >
> > What would be your solution?
> >
> > Thanks,
> >
> > Stacy
> >
> > __________________________________________________
> > Do You Yahoo!?
> > Check out Yahoo! Shopping and Yahoo! Auctions for all of
> > your unique holiday gifts! Buy at <http://shopping.yahoo.com/>
> > or bid at <http://auctions.yahoo.com/>
> >
> >
> --------------------------------------------------------------------------
> > -------
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> 1.8d
> > To unsubscribe, send a message to [log in to unmask] with following
> text in
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> message: SET
> > Technet NOMAIL
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> On-Line Resources & Databases >
> > E-mail Archives
> > Please visit IPC web site ( <http://www.ipc.org/html/forum.htm>)
> for
> > additional
> > information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700
> > ext.5315
> >
> --------------------------------------------------------------------------
> > -------
> Date: Thu, 13 Dec 2001 12:49:52 -0800
> From: Mark Mazzoli <[log in to unmask]>
> Subject: Re: porosity of gold plating on nickel
> MIME-Version: 1.0
> Content-Type: text/plain; charset="us-ascii"; format=flowed
>
> Hi Kris,
> Try IPC TM-650 2.3.24.2 Nitric Vapor Test. That's the easiest one
> I'm
> aware of.
> Here's a link: <http://www.ipc.org/html/2.3.24.2.pdf>
>
> Mark Mazzoli
>
>
>
>
>
>
> At 02:30 PM 12/13/01 -0500, you wrote:
>
> Does anyone know of a fairly simple method of determining
> porosity of gold
> plating over nickel on a PCB?
>
>
> Kristopher J. Keating
> Technical Service Engineer
> Circuit-Wise, Inc.
> 400 Sackett Point Rd.
> North Haven, CT 06473
> Tel. (203) 281-6511
> Fax (203) 287-8409
>
>
> --------------------------------------------------------------------------
> -------
> Technet Mail List provided as a free service by IPC using
> LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with
> following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following
> message: SET
> Technet NOMAIL
> Search previous postings at: www.ipc.org
> <http://www.ipc.org/> > On-Line Resources & Databases >
> E-mail Archives
> Please visit IPC web site (
> <http://www.ipc.org/html/forum.htm>) for additional
> information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700
> ext.5315
>
> --------------------------------------------------------------------------
> -------
>
>
>
>
> Date: Thu, 13 Dec 2001 13:44:57 -0700
> From: Steve Abrahamson <[log in to unmask]>
> Subject: Re: Inefficient solder on Toshiba micro BGA
> MIME-Version: 1.0
> Content-Type: text/plain; charset="iso-8859-1"
> Content-Transfer-Encoding: 7bit
>
> Hey Stacy,
>
> It sounds as though on paper, your process is OK. Just to fill you
> in on
> aspect ratio, that is aperture width/stencil thickness. This is a
> good rule
> of thumb for rectangular apertures such as for fine pitch
> components. For
> small circular or square apertures most people use the area aspect
> ratio
> which is aperture area/wall area. The area aspect ratio should be
> above
> 66. Thus on a .005" thick stencil with a .0135" square aperture you
> are
> looking at (.0135*.0135)/((.0135*.005)*4) = .675.
> Actually the area aspect ratio for a .0135" round aperture is the
> same as
> that for a square aperture, yet release on the square aperture has
> generally
> been proven to be better (don't forget a .002" or .003" radius on
> the
> corners).
>
> Anyway my point was going to be that I had the exact same apertures
> ordered
> on one particular project, and the apertures all clogged up (luckily
> we
> caught them at the visual step). It seems the apertures were
> severely
> undersized (more like .0122" x .0122"). So are your apertures
> really
> 0135"?
>
> As Kathy mentioned, kneed or condition your paste. The paste may
> take a few
> prints to fully mix and provide the thixotropic characteristics that
> you
> want. We use a dummy board for the first print, and then print our
> first
> production board.
>
> Personally I think you could get away with a .015" aperture if you
> are
> dealing with a .0315" pitch product. Even if they undercut your
> stencil,
> you should be fine.
>
> Good luck....
>
> Steve A
>
>
> > -----Original Message-----
> > From: My Nguyen [SMTP:[log in to unmask]]
> > Sent: Tuesday,December 11,2001 11:43 AM
> > To: [log in to unmask]
> > Subject: [TN] Inefficient solder on Toshiba micro BGA
> >
> > Hello all,
> >
> > Problem description:
> >
> > Been happening on Rambus - part number tc59rm81xmb.
> > Ball diametter: 0.5 mm; ball pitch: 0.8 mm, ball
> > height: 0.4 mm. Pad size: 0.3 mm (11.5 mils)
> > 5-10% of the time (we run huge amount of them) failure
> > modules came from opening soder join or no solder join
> > at all. As we inspect the screen printing process (we
> > use 5 mils stencil - Dek screenprinting, cleaning
> > rate: 2 per print, cleaning cycle Wet-Vacuum/Dry), we
> > found un-event solder deposit. Some pad even has very
> > little solder or no solder at all.
> >
> > Stencil is electro-polish; Diamond shape aperture,
> > 13.5 mils open used trapezoid shape.
> >
> > We afraid that if we open the apperture bigger, then
> > we may have bridging or solder ball. If we reduce the
> > stencil to 4 mils to reduce the blockage or
> > resistance, then we may have in-efficient solder or
> > many other problem relating thin stencil (damage,
> > short-life, etc)
> >
> > What would be your solution?
> >
> > Thanks,
> >
> > Stacy
> >
> > __________________________________________________
> > Do You Yahoo!?
> > Check out Yahoo! Shopping and Yahoo! Auctions for all of
> > your unique holiday gifts! Buy at <http://shopping.yahoo.com/>
> > or bid at <http://auctions.yahoo.com/>
> >
> >
> --------------------------------------------------------------------------
> > -------
> > Technet Mail List provided as a free service by IPC using LISTSERV
> 1.8d
> > To unsubscribe, send a message to [log in to unmask] with following
> text in
> > the BODY (NOT the subject field): SIGNOFF Technet
> > To temporarily halt delivery of Technet send the following
> message: SET
> > Technet NOMAIL
> > Search previous postings at: www.ipc.org <http://www.ipc.org/> >
> On-Line Resources & Databases >
> > E-mail Archives
> > Please visit IPC web site ( <http://www.ipc.org/html/forum.htm>)
> for
> > additional
> > information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700
> > ext.5315
> >
> --------------------------------------------------------------------------
> > -------
>
>
> --------------------------------------------------------------------------
> -------
> Technet Mail List provided as a free service by IPC using LISTSERV
> 1.8d
> To unsubscribe, send a message to [log in to unmask] with following
> text in
> the BODY (NOT the subject field): SIGNOFF Technet
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> SET Technet NOMAIL
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> On-Line Resources & Databases > E-mail Archives
> Please visit IPC web site ( <http://www.ipc.org/html/forum.htm>) for
> additional
> information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
>
> --------------------------------------------------------------------------
> -------
> Date: Thu, 13 Dec 2001 16:10:13 -0500
> From: Tony Steinke <[log in to unmask]>
> Subject: Re: .050 PWB
> MIME-Version: 1.0
> Content-Type: text/plain; charset="iso-8859-1"
> Content-Transfer-Encoding: 7bit
>
> Darrel,
> I don't mean to sound sarcastic, but almost all board shops should
> be able
> to manufacture you construction with their eyes closed.
> ----- Original Message -----
> From: Darrel Therriault <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Thursday, December 13, 2001 1:41 PM
> Subject: [TN] .050 PWB
>
>
> > Technet.....
> >
> > PWB designer and fab folks........We are considering building an
> .050"
> > PWB with 2 oz Cu, 6-8 layers.
> >
> > Any heartburn or horror stories with this design or is this within
> > normal capability from the design and fab perspective??
> >
> > DT
> >
> >
> >
> >
> > --
> > Darrel Therriault
> > VP, Mfg. Operations
> > INCEP Technologies, Inc
> > (858)547-9925 223
> > [log in to unmask]
> >
> >
> --------------------------------------------------------------------------
> -------
> > Technet Mail List provided as a free service by IPC using LISTSERV
> 1.8d
> > To unsubscribe, send a message to [log in to unmask] with following
> text in
> > the BODY (NOT the subject field): SIGNOFF Technet
> > To temporarily halt delivery of Technet send the following
> message: SET
> Technet NOMAIL
> > Search previous postings at: www.ipc.org <http://www.ipc.org/> >
> On-Line Resources & Databases >
> E-mail Archives
> > Please visit IPC web site ( <http://www.ipc.org/html/forum.htm>)
> for
> additional
> > information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700
> ext.5315
> >
> --------------------------------------------------------------------------
> -------
> Date: Thu, 13 Dec 2001 16:10:06 -0500
> From: Hinners Hans M Civ WRALC/LUGE <[log in to unmask]>
> Subject: Re: .050 PWB
> MIME-Version: 1.0
> Content-Type: text/plain; charset="iso-8859-1"
>
> Tony's right unless
> you do something "unadvisable" such as an unbalanced construction,
> isolated
> traces without thieving . . .
>
> Hans
> Integrity First - Service Before Self - Excellence in All We Do
> ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
> Hans M. Hinners
> Electronics Engineer
> Warner Robins - Air Logistics Center (WR-ALC/LUGE)
> 226 Cochran Street
> Robins AFB GA 31098-1622
>
> <mailto:[log in to unmask]>
>
> Com: (478) 926 - 5224
> Fax: (478) 926 - 4911
> DSN Prefix: 468
>
>
> -----Original Message-----
> From: Tony Steinke [ <mailto:[log in to unmask]>]
> Sent: Thursday, December 13, 2001 4:10 PM
> To: [log in to unmask]
> Subject: Re: [TN] .050 PWB
>
>
> Darrel,
> I don't mean to sound sarcastic, but almost all board shops should
> be able
> to manufacture you construction with their eyes closed.
> ----- Original Message -----
> From: Darrel Therriault <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Thursday, December 13, 2001 1:41 PM
> Subject: [TN] .050 PWB
>
>
> > Technet.....
> >
> > PWB designer and fab folks........We are considering building an
> .050"
> > PWB with 2 oz Cu, 6-8 layers.
> >
> > Any heartburn or horror stories with this design or is this within
> > normal capability from the design and fab perspective??
> >
> > DT
> >
> >
> >
> >
> > --
> > Darrel Therriault
> > VP, Mfg. Operations
> > INCEP Technologies, Inc
> > (858)547-9925 223
> > [log in to unmask]
> >
> >
> --------------------------------------------------------------------------
> -------
> > Technet Mail List provided as a free service by IPC using LISTSERV
> 1.8d
> > To unsubscribe, send a message to [log in to unmask] with following
> text in
> > the BODY (NOT the subject field): SIGNOFF Technet
> > To temporarily halt delivery of Technet send the following
> message: SET
> Technet NOMAIL
> > Search previous postings at: www.ipc.org <http://www.ipc.org/> >
> On-Line Resources & Databases >
> E-mail Archives
> > Please visit IPC web site ( <http://www.ipc.org/html/forum.htm>)
> for
> additional
> > information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700
> ext.5315
> >
> --------------------------------------------------------------------------
> -------
>
>
> --------------------------------------------------------------------------
> --
> -----
> Technet Mail List provided as a free service by IPC using LISTSERV
> 1.8d
> To unsubscribe, send a message to [log in to unmask] with following
> text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following message:
> SET
> Technet NOMAIL
> Search previous postings at: www.ipc.org <http://www.ipc.org/> >
> On-Line Resources & Databases >
> E-mail Archives
> Please visit IPC web site ( <http://www.ipc.org/html/forum.htm>) for
> additional
> information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700
> ext.5315
>
> --------------------------------------------------------------------------
> --
> -----
> Date: Thu, 13 Dec 2001 16:25:07 -0600
> From: Mike Clemente <[log in to unmask]>
> Subject: PCB Density Study/Design Quoting
> MIME-Version: 1.0
> Content-Type: text/plain; charset=US-ASCII
>
> Hello everyone,
>
> I need to find an accurate PCB density study method and also an
> efficient method of quoting PCB designs.
>
> Has anyone used the density study in IPC-2221? Is it accurate for
> Thru-hole and SMT? Are there other methods out there for density study?
>
> Also, does anyone have any specifics or know where to obtain
> information on Quoting PCB design from Schematic to Layout, to Manufacture
> and Assembly of PCB?
>
> Thanks,
>
> Mike Clemente, C.I.D.
> Sr. PCB Design Specialist
> dZinit Applied Technologies
> Tel: 847-545-8170
> Fax: 847-545-8175
> Email: [log in to unmask]
> Date: Thu, 13 Dec 2001 15:27:57 -0800
> From: Karla Thompson <[log in to unmask]>
> Subject: photoplotters
> MIME-Version: 1.0
> Content-Type: text/plain; charset="iso-8859-1"
>
> I'm in the process of looking at Photoplotters and would appreciate
> any
> input any of you may have. We currently have a 5-6 year old Barco
> Crescent
> 30. I'm looking at EIE, Orbotech, and Barco/Mania. If any of you
> have any
> comments on those, or any others (?) I'd appreciate it.
>
>
> Karla Thompson
> CAM Technician
> Electronic Controls Design, Inc
> Tel: (503) 829-9108
> email: [log in to unmask]
>
> Hi,
>
> I will be back on 12/17/01.
>
> Regards,
> Jong
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