At 12:12 PM 12/11/01 -0600, you wrote:
>Date: Tue, 11 Dec 2001 12:12:18 -0600
>Reply-To: TechNet <[log in to unmask]>
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>Subject: TechNet Digest - 10 Dec 2001 to 11 Dec 2001 - Special issue
>(#2001-771)
>To: Recipients of TechNet digests <[log in to unmask]>
>
>There are 15 messages totalling 922 lines in this issue.
>
>Topics in this special issue:
>
> 1. Shelve life for SMT/PTH components (3)
> 2. RF shielding
> 3. GEE Laminate Material? (5)
> 4. Sodium Silicate Contamination (5)
> 5. Panasonic - Siemens - Fuji Recommendations?
>
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>Date: Tue, 11 Dec 2001 00:12:15 -0800
>From: Peter Lee <[log in to unmask]>
>Subject: Shelve life for SMT/PTH components
>MIME-Version: 1.0
>Content-Type: text/plain; charset="us-ascii"
>Content-Transfer-Encoding: 7bit
>
>Hello,
>
>In general, what is the standard shelf life for the normal PTH and SMD
>components like DIP IC's, SOIC's, PLCC's?
>
>Assuming that they are non-MSD critical, what would be the proper
>storage method to ensure good solderability is being preserved (such as
>nitrogen storage chamber)?
>
>How significant is the impact of storage conditions (e.g. humidity,
>expose to ambient) and shelf life have on the solderability of component
>leads?
>
>
>Rgds,
>Peter
>
>
>_________________________________________________________
>Do You Yahoo!?
>Get your free @yahoo.com address at http://mail.yahoo.com
>Date: Tue, 11 Dec 2001 08:04:59 -0500
>From: "Sauer, Steven T." <[log in to unmask]>
>Subject: Re: RF shielding
>MIME-Version: 1.0
>Content-Type: text/plain; charset="iso-8859-1"
>
>Good Morning Genny,
>In simple terms, if you ground the cage then it's no longer isolated. If
>each test station is grounded then the test stations are electrically
>connected and suspect to ground transients (talk about spurious output
>problems). Think of safety first, if you're using an RF PA that arcs to the
>grounded cage, what happens? Do you ground ESD bags?
>Keep it simple, if you select the appropriate mesh, based on your frequency
>and power, there won't be any bouncing or reflecting, just simple
>absorption.
>
>-----Original Message-----
>From: Genny Gibbard [mailto:[log in to unmask]]
>Sent: Monday, December 10, 2001 5:41 PM
>To: [log in to unmask]
>Subject: Re: [TN] RF shielding
>
>
>Pardon me, but I'm not sure I understand why the cage should be isolated
>instead of grounded. Wouldn't 'grounding' the cage provide better
>'isolation' from test station to test station, instead of just bouncing or
>reflecting the signal, like I imagine an isolated cage would do?
>
>Currently we avoid crosstalk by planning what test stations are placed
>where, so that we don't put unshielded tests nearby critical spurious tests
>on another product line, for example. But as we get crowded, waiting for
>our new 'triple the size' production facility to be ready, we are running
>out of room to space our test stations adequately. In our new building,
>there will be no competing product line test benches backing on to each
>other - they will just have to worry about the ones to either side...
>Date: Tue, 11 Dec 2001 09:07:14 -0500
>From: Hinners Hans M Civ WRALC/LUGE <[log in to unmask]>
>Subject: GEE Laminate Material?
>MIME-Version: 1.0
>Content-Type: text/plain; charset="iso-8859-1"
>
>Hi All,
>
>I've got an call-out for GEE material but I can't find it in MIL-S-13949.
>Is there some other Mil spec I'm missing?
>
>Hans
>
>Integrity First - Service Before Self - Excellence in All We Do
>~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
>Hans M. Hinners
>Electronics Engineer
>Warner Robins - Air Logistics Center (WR-ALC/LUGE)
>226 Cochran Street
>Robins AFB GA 31098-1622
>
>mailto:[log in to unmask]
>
>Com: (478) 926 - 5224
>Fax: (478) 926 - 4911
>DSN Prefix: 468
>Date: Tue, 11 Dec 2001 09:10:09 -0500
>From: "Sauer, Steven T." <[log in to unmask]>
>Subject: Re: Shelve life for SMT/PTH components
>MIME-Version: 1.0
>Content-Type: text/plain; charset="iso-8859-1"
>
>Good morning Peter,
>I'm sure Dave Hillman will provide the most accurate response (IMHO) but
>until he comes around later in the day, I'll give my $.02.
>The first thing is to determine if the components are solderable upon
>receipt (reference J-STD-002) by performing a solderability test. If the
>leads/terminations pass the solderability test and no additional
>conditioning is performed, the components should be used within 120 days
>(guidance information developed under MIL-STD-2000 and predecessors).
>Longer storage can occur based on packaging, temperature, humidity and air
>particulates (i.e. dust, sulphur dioxide, chloride, ammonia). Previous
>guidance suggested that storage could be extended if storage conditions do
>not exceed 25°C and 50% RH, and sealed containers/bags are used. One note
>of caution is to ensure the storage containers/bags do not introduce
>contaminates (silicones, sulphur, polysulphides, etc.,) to the components
>that could degrade the solderability.
>As you mentioned, nitrogen storage is a good option, as it will minimize
>oxidation formation dependent on the purity and temp/humidity control, but
>this option comes with a cost.
>To summarize:
> - impose a solderability (coating durability) requirement on
>suppliers; component packaging requirements
> - verify solderability upon receipt or obtain certificate of
>compliance
> - develop FIFO material control
> - prepare for storage (repackage if necessary; original supplier
>packaging is usually suitable)
> - control environment
> - periodically perform solderability tests to determine adequacy of
>methods employed above.
>
>Good Luck!
>
>Steve Sauer
>Mfg Engineer
>Xetron Corporation
>
>-----Original Message-----
>In general, what is the standard shelf life for the normal PTH and SMD
>components like DIP IC's, SOIC's, PLCC's?
>
>Assuming that they are non-MSD critical, what would be the proper
>storage method to ensure good solderability is being preserved (such as
>nitrogen storage chamber)?
>
>How significant is the impact of storage conditions (e.g. humidity,
>expose to ambient) and shelf life have on the solderability of component
>leads?
>
>
>Rgds,
>Peter
>
>
>_________________________________________________________
>Do You Yahoo!?
>Get your free @yahoo.com address at http://mail.yahoo.com
>
>----------------------------------------------------------------------------
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>ext.5315
>----------------------------------------------------------------------------
>-----
>Date: Tue, 11 Dec 2001 09:33:14 -0500
>From: Keith Calhoun <[log in to unmask]>
>Subject: Re: GEE Laminate Material?
>MIME-Version: 1.0
>Content-Type: text/plain; charset=us-ascii
>Content-Transfer-Encoding: 7bit
>
>Hans,
>Try MIL-I-24768/2. We use this for insulating spacers, etc.
>Date: Tue, 11 Dec 2001 08:12:54 -0800
>From: Bernard Kessler <[log in to unmask]>
>Subject: Re: GEE Laminate Material?
>MIME-Version: 1.0
>Content-Type: text/plain; charset="iso-8859-1"
>Content-Transfer-Encoding: 7bit
>
>Talk about senior moments----- GEE is the original G10 callout in the 18911
>Spec ---- the unclad epoxy glass laminates. It moved into the early 13949
>copper-clad spec as GE callout along with the GF (for FR4) and GH for G11.
>Early in our laminate history, we certified to the unclad spec even though
>the laminate had copper cladding --- there was no spec for copper.
>Happy memories to all
>Bernie Kessler
>
>****************************************************************************
>*
>Bernard Kessler & Associates Ltd
>Tel: 714-898-8422 Fax: 562-431-1741
>www.home.earthlink.net/~bkesslerbka/
> Service is our Profession
>----- Original Message -----
>From: Hinners Hans M Civ WRALC/LUGE <[log in to unmask]>
>To: <[log in to unmask]>
>Sent: Tuesday, December 11, 2001 6:07 AM
>Subject: [TN] GEE Laminate Material?
>
>
> > Hi All,
> >
> > I've got an call-out for GEE material but I can't find it in MIL-S-13949.
> > Is there some other Mil spec I'm missing?
> >
> > Hans
> >
> > Integrity First - Service Before Self - Excellence in All We Do
> > ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
> > Hans M. Hinners
> > Electronics Engineer
> > Warner Robins - Air Logistics Center (WR-ALC/LUGE)
> > 226 Cochran Street
> > Robins AFB GA 31098-1622
> >
> > mailto:[log in to unmask]
> >
> > Com: (478) 926 - 5224
> > Fax: (478) 926 - 4911
> > DSN Prefix: 468
> >
> > --------------------------------------------------------------------------
>-------
> > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> > To unsubscribe, send a message to [log in to unmask] with following text in
> > the BODY (NOT the subject field): SIGNOFF Technet
> > To temporarily halt delivery of Technet send the following message: SET
>Technet NOMAIL
> > Search previous postings at: www.ipc.org > On-Line Resources & Databases >
>E-mail Archives
> > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
>additional
> > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
>ext.5315
> > --------------------------------------------------------------------------
>-------
>Date: Tue, 11 Dec 2001 18:24:01 +0200
>From: Brian Ellis <[log in to unmask]>
>Subject: Re: GEE Laminate Material?
>MIME-Version: 1.0
>Content-Type: text/plain; charset=us-ascii
>Content-Transfer-Encoding: 7bit
>
>Gee, Bernie, your memory is good. Guess us old timers can still earn our
>living!
>
>Best regards,
>
>Brian
>
>Bernard Kessler wrote:
> >
> > Talk about senior moments----- GEE is the original G10 callout in the 18911
> > Spec ---- the unclad epoxy glass laminates. It moved into the early 13949
> > copper-clad spec as GE callout along with the GF (for FR4) and GH for G11.
> > Early in our laminate history, we certified to the unclad spec even though
> > the laminate had copper cladding --- there was no spec for copper.
> > Happy memories to all
> > Bernie Kessler
> >
> >
> ****************************************************************************
> > *
> > Bernard Kessler & Associates Ltd
> > Tel: 714-898-8422 Fax: 562-431-1741
> > www.home.earthlink.net/~bkesslerbka/
> > Service is our Profession
> > ----- Original Message -----
> > From: Hinners Hans M Civ WRALC/LUGE <[log in to unmask]>
> > To: <[log in to unmask]>
> > Sent: Tuesday, December 11, 2001 6:07 AM
> > Subject: [TN] GEE Laminate Material?
> >
> > > Hi All,
> > >
> > > I've got an call-out for GEE material but I can't find it in MIL-S-13949.
> > > Is there some other Mil spec I'm missing?
> > >
> > > Hans
> > >
> > > Integrity First - Service Before Self - Excellence in All We Do
> > > ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
> > > Hans M. Hinners
> > > Electronics Engineer
> > > Warner Robins - Air Logistics Center (WR-ALC/LUGE)
> > > 226 Cochran Street
> > > Robins AFB GA 31098-1622
> > >
> > > mailto:[log in to unmask]
> > >
> > > Com: (478) 926 - 5224
> > > Fax: (478) 926 - 4911
> > > DSN Prefix: 468
> > >
> > >
> --------------------------------------------------------------------------
> > -------
> > > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> > > To unsubscribe, send a message to [log in to unmask] with following text in
> > > the BODY (NOT the subject field): SIGNOFF Technet
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> Databases >
> > E-mail Archives
> > > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> > additional
> > > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> > ext.5315
> > >
> --------------------------------------------------------------------------
> > -------
> >
> >
> --------------------------------------------------------------------------
> -------
> > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> > To unsubscribe, send a message to [log in to unmask] with following text in
> > the BODY (NOT the subject field): SIGNOFF Technet
> > To temporarily halt delivery of Technet send the following message: SET
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> Databases > E-mail Archives
> > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> > information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> >
> --------------------------------------------------------------------------
> -------
>Date: Tue, 11 Dec 2001 09:35:19 -0700
>From: "Faraci, Jennifer L" <[log in to unmask]>
>Subject: Sodium Silicate Contamination
>MIME-Version: 1.0
>Content-Type: text/plain; charset="iso-8859-1"
>
>Does anybody have any information regarding Sodium Silicate particle
>contamination? I'm looking for information regarding it's effect on
>circuit cards, other equipment, and any possible health concerns it may
>cause.
>
>Thanks,
>
>Jennifer
>Date: Tue, 11 Dec 2001 19:00:00 +0200
>From: Brian Ellis <[log in to unmask]>
>Subject: Re: Sodium Silicate Contamination
>MIME-Version: 1.0
>Content-Type: text/plain; charset=us-ascii
>Content-Transfer-Encoding: 7bit
>
>Jennifer
>
>What do you mean by sodium silicate? If we take this literally with the
>formula Na0(n)SiO2, where n is usually between 3 and 6, you are in deep
>trouble. This is a deliquescent, amorphous substance which will turn
>into waterglass by absorption of atmospheric humidity. Apart from this,
>it becomes a viscous liquid to which anything will stick.
>
>Sodium disilicate, metasilicate and orthosilicate aren't quite as bad,
>but are nearly so. They are all highly water-soluble and may be
>hygroscopic, to some extent.
>
>Brian
>
>
>"Faraci, Jennifer L" wrote:
> >
> > Does anybody have any information regarding Sodium Silicate particle
> > contamination? I'm looking for information regarding it's effect on
> > circuit cards, other equipment, and any possible health concerns it may
> > cause.
> >
> > Thanks,
> >
> > Jennifer
> >
> >
> --------------------------------------------------------------------------
> -------
> > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> > To unsubscribe, send a message to [log in to unmask] with following text in
> > the BODY (NOT the subject field): SIGNOFF Technet
> > To temporarily halt delivery of Technet send the following message: SET
> Technet NOMAIL
> > Search previous postings at: www.ipc.org > On-Line Resources &
> Databases > E-mail Archives
> > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> > information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> >
> --------------------------------------------------------------------------
> -------
>Date: Tue, 11 Dec 2001 12:12:46 EST
>From: "<Rudy Sedlak>" <[log in to unmask]>
>Subject: Re: Sodium Silicate Contamination
>MIME-Version: 1.0
>Content-Type: text/plain; charset="US-ASCII"
>Content-Transfer-Encoding: 7bit
>
>Jennifer:
>
>Allow me to ask why you are interested, and where you have the potential for
>contamination by Sodium Silicate.
>
>Sodium Silicate is a very common ingredient in water based alkaline (read
>this as high pH) detergents, and is commonly used as an anti-tarnish,
>anti-corrosion agent in these detergents. Most machine dishwashing compounds
>have sodium silicate in them.
>
>It can cause problems if the pH of the cleaner gets too low, as it always
>does in a rinse. It can also cause problems in high water hardness, where it
>reacts with the water hardness, and falls out of solution as typically
>Calcium Silicate.
>
>And even if you have enough water softener in the detergent to overcome the
>hardness in the cleaner itself, in the rinse you can still generate Calcium
>Silicate.
>
>My recommendation is to avoid Sodium Silicate in general, unless you have a
>well formulated product with enough water softeners, and a good,
>non-recirculating rinse.
>
>Rudy Sedlak
>RD Chemical Company
>Date: Tue, 11 Dec 2001 12:18:04 -0500
>From: Bev Christian <[log in to unmask]>
>Subject: Re: Sodium Silicate Contamination
>MIME-Version: 1.0
>Content-Type: text/plain; charset="iso-8859-1"
>
>Jennifer,
>It all depends... our favourite answer.
>
>There are hundreds of sodium silicates but lets keep it to the families that
>are the most likely - short chain, long chain and zeolites (which are sodium
>aluminosilicates). The first are soluble and the last will exchange sodium
>ions for higher charged ions. This would be bad news. If we are talking
>about drying packets (silica gel) then my concern would be were they
>properly washed to remove all soluble silicates before the particles were
>dried to be activated to absorb moisture.
>
>regards,
>Bev Christian
>Research in Motion
>
>-----Original Message-----
>From: Faraci, Jennifer L [mailto:[log in to unmask]]
>Sent: December 11, 2001 11:35 AM
>To: [log in to unmask]
>Subject: [TN] Sodium Silicate Contamination
>
>
>Does anybody have any information regarding Sodium Silicate particle
>contamination? I'm looking for information regarding it's effect on
>circuit cards, other equipment, and any possible health concerns it may
>cause.
>
>Thanks,
>
>Jennifer
>
>----------------------------------------------------------------------------
>-----
>Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
>To unsubscribe, send a message to [log in to unmask] with following text in
>the BODY (NOT the subject field): SIGNOFF Technet
>To temporarily halt delivery of Technet send the following message: SET
>Technet NOMAIL
>Search previous postings at: www.ipc.org > On-Line Resources & Databases >
>E-mail Archives
>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
>information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
>ext.5315
>----------------------------------------------------------------------------
>-----
>Date: Tue, 11 Dec 2001 11:26:40 -0600
>From: Jack Crawford <[log in to unmask]>
>Subject: Re: Shelve life for SMT/PTH components
>MIME-Version: 1.0
>Content-Type: multipart/alternative; boundary="=_F2AFD5F1.CCADCBB1"
>
>In addition to the good solderability info from Steve in this msg thread,
>moisture sensitivity needs to be considered. J-STD-020 is used by
>component manufacturers to classify the moisture sensitivity level of
>components (how easily they will "popcorn" in reflow). J-STD-033 is a
>companion standard for packaging and labeling the components for storage
>and includes some time requirements and bakeout guidelines. You can see
>table of contents and scope/purpose info by downloading from
><http://www.ipc.org/TOC/J-STD-033.pdf>http://www.ipc.org/TOC/J-STD-033.pdf
>
>Remember that bakeout can affect solderability.
>
>Jack
>
>==========================================
>APEX - the industry's premier trade show in Electronics
>Manufacturing, January 22-24, 2002, San Diego, California.
>More information on website <http://www.goapex.org>www.goapex.org
>--------
>Jack Crawford, IPC Director of Assembly Standards and Technology
>2215 Sanders Road, Northbrook IL 60062-6135
><mailto:[log in to unmask]>[log in to unmask]
>847-790-5393
>fax 847-504-2393
>
> >>> [log in to unmask] 12/11/01 08:10AM >>>
>Good morning Peter,
>I'm sure Dave Hillman will provide the most accurate response (IMHO) but
>until he comes around later in the day, I'll give my $.02.
>The first thing is to determine if the components are solderable upon
>receipt (reference J-STD-002) by performing a solderability test. If the
>leads/terminations pass the solderability test and no additional
>conditioning is performed, the components should be used within 120 days
>(guidance information developed under MIL-STD-2000 and predecessors).
>Longer storage can occur based on packaging, temperature, humidity and air
>particulates (i.e. dust, sulphur dioxide, chloride, ammonia). Previous
>guidance suggested that storage could be extended if storage conditions do
>not exceed 25°C and 50% RH, and sealed containers/bags are used. One note
>of caution is to ensure the storage containers/bags do not introduce
>contaminates (silicones, sulphur, polysulphides, etc.,) to the components
>that could degrade the solderability.
>As you mentioned, nitrogen storage is a good option, as it will minimize
>oxidation formation dependent on the purity and temp/humidity control, but
>this option comes with a cost.
>To summarize:
> - impose a solderability (coating durability) requirement on
>suppliers; component packaging requirements
> - verify solderability upon receipt or obtain certificate of
>compliance
> - develop FIFO material control
> - prepare for storage (repackage if necessary; original supplier
>packaging is usually suitable)
> - control environment
> - periodically perform solderability tests to determine adequacy of
>methods employed above.
>
>Good Luck!
>
>Steve Sauer
>Mfg Engineer
>Xetron Corporation
>
>-----Original Message-----
>In general, what is the standard shelf life for the normal PTH and SMD
>components like DIP IC's, SOIC's, PLCC's?
>
>Assuming that they are non-MSD critical, what would be the proper
>storage method to ensure good solderability is being preserved (such as
>nitrogen storage chamber)?
>
>How significant is the impact of storage conditions (e.g. humidity,
>expose to ambient) and shelf life have on the solderability of component
>leads?
>
>
>Rgds,
>Peter
>Date: Tue, 11 Dec 2001 10:35:57 -0700
>From: "Faraci, Jennifer L" <[log in to unmask]>
>Subject: Re: Sodium Silicate Contamination
>MIME-Version: 1.0
>Content-Type: text/plain
>
>We've found sodium silicate particles on equipment due to over application
>of floor sealant. I'm looking for information regarding if it will effect
>our equipment performance either electrically or mechanically, or the health
>of employees who use it. If a complete cleaning is necessary, what would be
>the best way to remove the sodium sulfate contamination without damaging our
>equipment?
>
>Jennifer
>
>-----Original Message-----
>From: <Rudy Sedlak> [mailto:[log in to unmask]]
>Sent: Tuesday, December 11, 2001 10:13 AM
>To: [log in to unmask]
>Subject: Re: [TN] Sodium Silicate Contamination
>
>
>Jennifer:
>
>Allow me to ask why you are interested, and where you have the potential for
>contamination by Sodium Silicate.
>
>Sodium Silicate is a very common ingredient in water based alkaline (read
>this as high pH) detergents, and is commonly used as an anti-tarnish,
>anti-corrosion agent in these detergents. Most machine dishwashing
>compounds
>have sodium silicate in them.
>
>It can cause problems if the pH of the cleaner gets too low, as it always
>does in a rinse. It can also cause problems in high water hardness, where
>it
>reacts with the water hardness, and falls out of solution as typically
>Calcium Silicate.
>
>And even if you have enough water softener in the detergent to overcome the
>hardness in the cleaner itself, in the rinse you can still generate Calcium
>Silicate.
>
>My recommendation is to avoid Sodium Silicate in general, unless you have a
>well formulated product with enough water softeners, and a good,
>non-recirculating rinse.
>
>Rudy Sedlak
>RD Chemical Company
>
>----------------------------------------------------------------------------
>-----
>Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
>To unsubscribe, send a message to [log in to unmask] with following text in
>the BODY (NOT the subject field): SIGNOFF Technet
>To temporarily halt delivery of Technet send the following message: SET
>Technet NOMAIL
>Search previous postings at: www.ipc.org > On-Line Resources & Databases >
>E-mail Archives
>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
>information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
>ext.5315
>----------------------------------------------------------------------------
>-----
>Date: Tue, 11 Dec 2001 12:46:57 -0500
>From: Hinners Hans M Civ WRALC/LUGE <[log in to unmask]>
>Subject: Re: GEE Laminate Material?
>MIME-Version: 1.0
>Content-Type: text/plain; charset="iso-8859-1"
>
>Bernie,
>
>You are the man!
>I was guessing it had to be G-10 from the look of the stuff but I still need
>to document it.
>Now onto the IHS website to look the bloody thing up.
>
>Thanks!
>
>Hans
>Integrity First - Service Before Self - Excellence in All We Do
>~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
>Hans M. Hinners
>Electronics Engineer
>Warner Robins - Air Logistics Center (WR-ALC/LUGE)
>226 Cochran Street
>Robins AFB GA 31098-1622
>
>mailto:[log in to unmask]
>
>Com: (478) 926 - 5224
>Fax: (478) 926 - 4911
>DSN Prefix: 468
>
>
>-----Original Message-----
>From: Bernard Kessler [mailto:[log in to unmask]]
>Sent: Tuesday, December 11, 2001 11:13 AM
>To: [log in to unmask]
>Subject: Re: [TN] GEE Laminate Material?
>
>
>Talk about senior moments----- GEE is the original G10 callout in the 18911
>Spec ---- the unclad epoxy glass laminates. It moved into the early 13949
>copper-clad spec as GE callout along with the GF (for FR4) and GH for G11.
>Early in our laminate history, we certified to the unclad spec even though
>the laminate had copper cladding --- there was no spec for copper.
>Happy memories to all
>Bernie Kessler
>
>****************************************************************************
>*
>Bernard Kessler & Associates Ltd
>Tel: 714-898-8422 Fax: 562-431-1741
>www.home.earthlink.net/~bkesslerbka/
> Service is our Profession
>----- Original Message -----
>From: Hinners Hans M Civ WRALC/LUGE <[log in to unmask]>
>To: <[log in to unmask]>
>Sent: Tuesday, December 11, 2001 6:07 AM
>Subject: [TN] GEE Laminate Material?
>
>
> > Hi All,
> >
> > I've got an call-out for GEE material but I can't find it in MIL-S-13949.
> > Is there some other Mil spec I'm missing?
> >
> > Hans
> >
> > Integrity First - Service Before Self - Excellence in All We Do
> > ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
> > Hans M. Hinners
> > Electronics Engineer
> > Warner Robins - Air Logistics Center (WR-ALC/LUGE)
> > 226 Cochran Street
> > Robins AFB GA 31098-1622
> >
> > mailto:[log in to unmask]
> >
> > Com: (478) 926 - 5224
> > Fax: (478) 926 - 4911
> > DSN Prefix: 468
> >
> > --------------------------------------------------------------------------
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>-----
>Date: Tue, 11 Dec 2001 10:06:46 -0800
>From: Rick Thompson <[log in to unmask]>
>Subject: Panasonic - Siemens - Fuji Recommendations?
>MIME-Version: 1.0
>Content-Type: text/plain; charset="us-ascii"
>Content-Transfer-Encoding: 7bit
>
>We're looking at possibly installing a new line and I'm hoping some of
>you might care to share your opinions, recommendations, pro or con on
>Panasonic, Siemens, Fuji from current users. If you have any insight
>you wouldn't mind sharing, please contact me offline.
>
>Thanks in advance.
>
>
>Rick Thompson
>Ventura Electronics Assembly
>2655 Park Center Dr.
>Simi Valley, CA 93065
>
>+1 (805) 584-9858 x-304 voice
>+1 (805) 584-1529 fax
>[log in to unmask]
Hi,
I will be back on 12/17/01.
Regards,
Jong
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