TECHNET Archives

December 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Zweigart, Siegmund" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 12 Dec 2001 19:02:24 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (37 lines)
Hello

We are trying to do a detailed Qualification of an assembly and repair-
process for LLP (and similar)- packages.
Has anybody infomation regarding this subjects.
Will the amount of LLP increase in the future?
How can I get information about this topic?

Best regards

Siegmund Zweigart
----------------------------------------------------------------------------
--------------------
Kind regards / Mit freundlichen Grüßen

Dr. Siegmund Zweigart
New Technology Manager

Solectron GmbH
Solectronstrasse 2                   Fon. ++49 7032 998 194
D - 71083 Herrenberg                Fax  ++49 7032 998 49 222

e-mail: [log in to unmask]
internet: www.solectron.com
----------------------------------------------------------------------------
--------------------

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2