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Subject:	Re: To form or not to Form
From:	David Hillman <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 12 Dec 2001 08:59:58 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (60 lines)

Hi Andre! One of my mentor's always used to tell me that the theme song for
components which do not incorporation stress relief in the lead
configuration was "Pop goes the Weasel"! In fact he used to hum the tune
during design/producibility reviews. No stress relief is a bad idea unless
you like cracked solder joints or damage components.

Dave Hillman
Rockwell Collins
[log in to unmask]





Andre Leclair <[log in to unmask]>@ipc.org> on 12/12/2001 07:25:59 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>

Sent by:  TechNet <[log in to unmask]>


To:   [log in to unmask]
cc:

Subject:  [TN] To form or not to Form


Hi all
I hope this gets some good advice.

I have a customer who is requiring the placement of an electrolitic cap
that has a lead spacing of 0.140" and the PCB has 0.100".  They do not want
the leads formed, they want the part flat to the board.  In doing this, am
I opening myself up to stress induced failures of the component.

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