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Subject:	Re: Inefficient solder on Toshiba micro BGA
From:	[log in to unmask]
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 11 Dec 2001 13:04:31 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (13 lines)

we have a .75 mm pitch device with same issue, try pad size at .014" and square
appature .014" . also experiment with differant paste types 3 or 4

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