Hello all,

A customer of mine wanted to simulate the heat dissipation within a
board (burn-in and test boards for CSP) and thus I tried to get these
values for some high-Tg materials. All I found was 0.3 W/(m*K) für
some Arlon materials (88N). They refer to a ASTM E-1225 method.

My questions:

I would assume, there is a different thermal conductivity in x/y and
z direction for any substrates with E-glass inside. Where can I find
such values? Which test method would be appropiate?

Has anybody a short summary/comparison or a good WWW link about the
different (mostly ASTM) methods and their pros and cons?

Has anybody made such thermal conductivity measurements especially
for G30 or P95 or Duraver PD or Arlon 35N, all in 0.8 mm thickness,
18 um copper and would be willing to share the results?

Thanks a lot, best regards
Matthias Mansfeld
-----------------------------------------------
Matthias Mansfeld Elektronik
* Leiterplattenlayout, Bestueckung
Am Langhoelzl 11, 85540 Haar; Tel.: 089/4620 093-7, Fax: -8
Internet: http://www.mansfeld-elektronik.de

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