I am trying to do some repairs on vias of an assembled board that were
damaged due to test technicians scraping soldermask for ICT.  The vias show
signs of thinning/cracking at the knee.  IPC 7721 shows that using eyelets
are the acceptable repair for plated thru holes but they do not address vias
anywhere that I am aware of.  I can't imagine putting eyelets into a via.

I am considering putting a solid wire into the via and filling it with
solder to make the connection from top to bottom.  Is this acceptable?  If
not then what is an acceptable method of repair?  Any input would be
appreciated.

Sincerely
Jim


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