Thanks Werner,

You clarified much though the phenomonon seems benign to most in industry.
Even after all these years, it does look scary.

My question about etchback and smear removal was aimed more at plating
adhesion during resin expansion and recession. I was just wondering if less
was better as a function of adhesion and what might negatively affect it.
I'm trying to look at it as the plating should follow the resin movement if
the adhesion characteristics were better on a "smoother" surface than one
etched back to, say, the maximum .003" number.

You shed good light on plating thickness, number of layers, and dielectric
thickness. I see where thinner dielectrics would not offer resin the
opportunity to move so much.

Earl Moon

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