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December 2001

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Subject:
From:
David Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 6 Dec 2001 12:48:14 -0600
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Hi Stella! Just one bit of information to add to Steve's great information
- use the IPC JSTD-002A solderability specification as you tool/method of
demonstrating that the solderability and/or leaching is your problem. We
have experienced similar problems in the past and poor solderability of the
components was problem.

Dave Hillman
Rockwell Collins
[log in to unmask]




Stella Neyman <[log in to unmask]>@ipc.org> on 12/05/2001 05:53:55 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>

Sent by:  TechNet <[log in to unmask]>


To:   [log in to unmask]
cc:

Subject:  [TN] Platinum/Palladium/Silver plating


Dear technetts, Please help me out.
We are introducing new custom made SMT component: Medium size (approx. 0.5"
x 0.200") with 2 ceramic terminations that plated with Pt/Pd/Ag coating.
Solder paste for our reflow process is 63Sn/37Pb NC low residue. Reflow
profile is standard for this paste reflow peak temp of 220-225 deg C and 50
sec above 183 deg C.
We are experiencing non-wetting conditions on components terminations, some
solder joints cracked during thermocycling testing.
Does anybody experience problem with Pt/Pd/Ag coating over ceramic
substrate?
Any information would be greatly appreciated.
Sincerely
Stella Neyman
Jabil Circuit, MI

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