Two considerations to mention are less cost for immersion silver compared to
ENIG and from a former process engineer the ability to rework immersion
silver. Rework of ENIG never panned out for me personally. The silver can be
stripped and re-plated.

My $0.02 worth.

Russ Burdick


>From: Charles McMahon <[log in to unmask]>
>Reply-To: "TechNet E-Mail Forum." <[log in to unmask]>
>To: [log in to unmask]
>Subject: [TN] SURFACE FINISHES
>Date: Wed, 5 Dec 2001 11:51:29 -0500
>
>TO Tech-Net:
>
>As an advocate for ENIG for fine pitch designs, I am asking for input on
>whether moving towards a silver product
>is more efficient a performer at the assembly level. Finishes such as
>Alpha Level have been available but have not
>replaced the current slate that appears common; ie. white tin or ENIG.
>
>Question: Are silver finishes more cost effective at the board
>fabricator while at the same time being process friendly
>at the assembler than ENIG or white tin? HASL is not one that I believe
>will be an option much longer due to the
>de-leading of the inductry so I have not included that choice.
>
>I know the list as addressed facets of this issues in the past however
>would appreciate any inputs.
>
>Charlie McMahon.
>
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