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December 2001

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 6 Dec 2001 11:19:16 EST
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Hi Jorge,
When you say: "the oven profile was also verified and it's always within the
solder paste manufacturer's recommendations," how and where did you verify
the profile? How large is this component?
My guess is that your reflow oven recipe is too low to produce an adequate
reflow profile for this component and this surface finish on the leads.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 386-437-8747, Fax: 386-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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