Hi Jerry,

you should look at the specs regarding the hight you reach when the deposit
is melting and becoming convex again. Does this specified hight comply with
components coplanarity tolerances ?

This made me think about this technology ...

Wolfgang

> -----Original Message-----
> From: Jerry Mosur [mailto:[log in to unmask]]
> Sent: Wednesday, December 05, 2001 10:15 PM
> To: [log in to unmask]
> Subject: [TN] SiPAD
>
>
> Greetings,
>
> Our assembly guys came across a PCB product called SiPAD. It
> is a patented
> (by Siemens) way of adding a layer of SMD paste, then curing
> and leveling it
> and finally spraying the whole board with a layer of flux. A layer of
> protective paper is applied over the entire surface so the
> flux doesn't dry
> out and stays tacky.
> The claim to fame is that it is suppose to save one
> manufacturing step,
> solder paste application.
>
> Any comments?
>
> Thanks in advance.
>
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