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December 2001

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Subject:
From:
"Busko, Wolfgang" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 6 Dec 2001 10:18:37 +0100
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text/plain (66 lines)
Hi Stella,

you may look at Texas Instruments page, there you will find an article about
this finish and recommendations how to deal with that. It may be of some
help.

Good luck

Wolfgang

> -----Original Message-----
> From: Stella Neyman [mailto:[log in to unmask]]
> Sent: Thursday, December 06, 2001 12:54 AM
> To: [log in to unmask]
> Subject: [TN] Platinum/Palladium/Silver plating
>
>
> Dear technetts, Please help me out.
> We are introducing new custom made SMT component: Medium size
> (approx. 0.5"
> x 0.200") with 2 ceramic terminations that plated with
> Pt/Pd/Ag coating.
> Solder paste for our reflow process is 63Sn/37Pb NC low
> residue. Reflow
> profile is standard for this paste reflow peak temp of
> 220-225 deg C and 50
> sec above 183 deg C.
> We are experiencing non-wetting conditions on components
> terminations, some
> solder joints cracked during thermocycling testing.
> Does anybody experience problem with Pt/Pd/Ag coating over ceramic
> substrate?
> Any information would be greatly appreciated.
> Sincerely
> Stella Neyman
> Jabil Circuit, MI
>
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