Dear technetts, Please help me out.
We are introducing new custom made SMT component: Medium size (approx. 0.5"
x 0.200") with 2 ceramic terminations that plated with Pt/Pd/Ag coating.
Solder paste for our reflow process is 63Sn/37Pb NC low residue. Reflow
profile is standard for this paste reflow peak temp of 220-225 deg C and 50
sec above 183 deg C.
We are experiencing non-wetting conditions on components terminations, some
solder joints cracked during thermocycling testing.
Does anybody experience problem with Pt/Pd/Ag coating over ceramic
substrate?
Any information would be greatly appreciated.
Sincerely
Stella Neyman
Jabil Circuit, MI

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