TECHNET Archives

December 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Furrow, Robert Gordon (Bob)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 5 Dec 2001 16:21:26 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (57 lines)
What happens with double sided SMT which is becoming more prevalent?

Thanks,
Robert Furrow
Printed Wiring Board Engineer
Strategic Supply Global Account Manager
Supply Chain Networks
Lucent Technologies
978-960-3224    [log in to unmask]


-----Original Message-----
From: Jerry Mosur [mailto:[log in to unmask]]
Sent: Wednesday, December 05, 2001 4:15 PM
To: [log in to unmask]
Subject: [TN] SiPAD


Greetings,

Our assembly guys came across a PCB product called SiPAD. It is a patented
(by Siemens) way of adding a layer of SMD paste, then curing and leveling it
and finally spraying the whole board with a layer of flux. A layer of
protective paper is applied over the entire surface so the flux doesn't dry
out and stays tacky.
The claim to fame is that it is suppose to save one manufacturing step,
solder paste application.

Any comments?

Thanks in advance.

----------------------------------------------------------------------------
-----
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET
Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
----------------------------------------------------------------------------
-----

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2