Hi, Vinit.

This is a topic which comes up on a regular basis, and has been thoroughly
scrutinised in this forum. The consensus is that whilst there may once have
been a real concern, with modern equipment the chances of a problem
occurring are slight at most. I suggest you visit the TechNet archives at
www.IPC.org to find your answer and info to support this statement. You will
find reams.

Happy New Year


Mike Fenner
Applications Engineer, European Operations
Indium Corporation
 T: + 44 1908 580 400
M: + 44 7810 526 317
 F: + 44 1908 580 411
 E: [log in to unmask]
W: www.indium.com
Leadfree: www.Pb-Free.com



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Vinit Verma
Sent: Thursday, December 27, 2001 10:48 AM
To: [log in to unmask]
Subject: [TN] Ultrasonic Cleaning


Hi Technetters,

I am presently evaluating post reflow PCB cleaning machines, both aqueous
and ultrasonic. I have a concern regarding ultrasonic cleaning. Read
somewhere that the ultrasonic frequencies can have an effect on the wire
bonds inside the packaging. Does anyone have any idea of this?

Thanks in anticipation.

Regards
Vinit Verma

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