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December 2001

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Subject:
From:
Jorge Rodriguez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 5 Dec 2001 10:13:43 -0700
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        I already sent this e-mail on the past, got one answer, I hope there
is somebody out there having the same issue.


        Fellow Technetters:

                I am sending this looking for any help, I guess I've done
everything as far as the process and I haven't been able to resolve the
issue. We've been having soldering problems for a while with QFPs with 85
Sn/15 Pb finish on the leads. The solder doesn't flow properly and an
acceptable solder joint is not formed, the leads can be sometimes lifted
with no effort. The solder paste was checked after the screen printer
operation and it looked alright, the oven profile was also verified and it's
always within the solder paste manufacturer's recommendations. This problem
seems to be affecting all the different products with this type of
component. These part numbers are manufactured by Altera. Has anybody
experienced similar problems with QFPs from this manufacturer?, Does anybody
have recommendations as far as the reflow oven profile?. I read somewhere
that this particular alloy has the liquidus temperature at 205 degrees, is
this accurate?

        Any help would be really appreciated

Jorge Rodriguez
Sr Process Engineer
Varian Electronics Manufacturing
615 South River Drive
E-mail: [log in to unmask]

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