Techies,
I have a circuit board with 0.024" diameter (finished size) vias.
I'd like to tent them in the final design. My question: Am I better off
specifying dry-film soldermask as opposed to LPI? Is there a cost tradeoff
with dry film? Is it hard to work with or hard to get? It seems to have
fallen out of favor lately, so that's why I'm asking. Thanks in advance.
~Mike
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