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Sender:	TechNet <[log in to unmask]>
Subject:	Re: Increasing Silver thickness in immersion Plating
From:	Bev Christian <[log in to unmask]>
Date:	Tue, 4 Dec 2001 18:20:32 -0500
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Reply-To:	"TechNet E-Mail Forum." <[log in to unmask]>
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Werner,
Do you know of any good references in the open literature about tin/silver
Intermetallics?  I would really appreciate any citations you can give me.
regards,
Bev Christian
research in Motion

-----Original Message-----
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: December 3, 2001 10:55 PM
To: [log in to unmask]
Subject: Re: [TN] Increasing Silver thinkness in immersion Plating


Hi Rudy,
Increased Ag thickness may or may not increase solderability shelf life, but
it would do one thing for sure, reduce solder joint reliability. 'Gold
embrittlement' is nothing compared to what too much Ag-Sn IMCs do.

Werner Engelmaier

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