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December 2001

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Thu, 13 Dec 2001 15:09:32 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>
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Guy Ramsey <[log in to unmask]>
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I think IPC-2222 provides some of the kind of guidance you are requesting.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Frank Kimmey
> Sent: Thursday, December 13, 2001 2:28 PM
> To: [log in to unmask]
> Subject: [TN] Traces beneath components
>
>
> I have been asked to justify routing of traces beneath chip components.
> Does anyone have a spec, standard or documentation defining what trace
> widths should be allowed beneath what packages?
> As always any help is appreciated and all comments are solicited.
> Thanks in Advance
> FNK
>
> Frank N Kimmey, C.I.D.+
> Senior PCB Designer
> Powerwave Technologies
> PH. 916-941-3159
> Fax 916-941-3195
>
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