Werner,

Realizing you've talked about this before, I would ask:

Resin recedes back into the structure, away from the hole wall, during
thermal stress and returns to original geometry after cooling? Copper does not?

If all this is true, and it must be as you say, is there any indication the
original plating (catalytic or direct electroless deposition plus
electroplating process) has problems? If expected quality was realized,
wouldn't the copper "follow" the resin into recession? Also, does overly
agressive etch-back accompanied by glass fiber removal, say, beyond some
number, contribute to the condition? I mean, would smear removal be a better
process or a less agressive etch-back?

Earl Moon

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------