We use Conceptronic Freedom2000 and it does a reasonable job.  Generally,
one tries to imitate the profile used for placement.  The Conceptronic helps
establish the profile but you must embed up to 4 thermocouples in a scrap or
dummy board in order to accurately establish the time/temperature profile
you need.  The computer will store many profiles and there are two access
levels to allow the repair operator to access the engineer-established
profiles but not change them.  The repair station will display the profile
graphically.

George Carroll
Process Engineer
Siemens Energy and Automation
Johnson City, TN

[log in to unmask]

-----Original Message-----
From: Vaishnav, Bankim [mailto:[log in to unmask]]
Sent: Wednesday, November 07, 2001 3:51 PM
To: [log in to unmask]
Subject: [TN] BGA rework


Any thoughts on better auto / semi auto BGA rework equipment to use  - SRT,
AIRVAC, PACE or any other available.

Also, about profiling for removing and replacing BGA from the Bonded
assembly / chassis assembly. Is it generally done or need to remove board
assembly from boded assembly  / chassis assembly first prior to BGA rework.

Bankim

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