Patrick,

Sorry for the delay getting back i use leading and traailing solder thieves,
because some of our panels have pcbs which are mirror images of one another.
The rule of thumb i use is a solder thief that is at least three times the
size of  the component pad, and placed on the same pitch, but not connected
to the last pad of the component.

regards,

steve.

-----Original Message-----
From: Patrick Lam [mailto:[log in to unmask]]
Sent: 23 October 2001 17:41
To: [log in to unmask]
Subject: Re: [TN] Land pattern for wave soldering


Hi Steve,

Thanks for the prompt response.

What kind of solder thieves should I put in, say a SOIC08? Do I need to put
in
leading pads and leading pads? Is there any standard published that I can
find
or buy regarding wave soldering issues?

Thanks for the support.

Patrick




Steve Owen <[log in to unmask]> on 10/23/2001 09:03:04 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Patrick Lam/SEL)
Subject:  Re: [TN] Land pattern for wave soldering



Hi Patrick,

If you look at say a side one footprint(reflow)for quad flat pack as opposed
to a side two (wavesolder)side. On side two you will ideally need to present
the component @ 45 deg to the wave and have solder thieves in each of the
four corners to eliminate solder bridges.

just an example.

hope its of some use.

-----Original Message-----
From: Patrick Lam [mailto:[log in to unmask]]
Sent: 23 October 2001 16:26
To: [log in to unmask]
Subject: [TN] Land pattern for wave soldering


Hi Technetters,

Is there a need to have different SMD land size/ pattern for wave soldering?
Any
suggestion is appreciated.

Thanks,
Patrick

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