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November 2001

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Subject:
From:
Ryan Grant <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 6 Nov 2001 17:06:06 -0700
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Hi Genny,

Don't worry about using HASL with BGA's.  They will be just fine.  Fine
pitch on the other hand....

Kind Regards

Ryan Grant
Advanced Technology Engineer
MCMS
(208) 898-1145
[log in to unmask]


> -----Original Message-----
> From: Genny Gibbard [SMTP:[log in to unmask]]
> Sent: Tuesday, November 06, 2001 3:16 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] BGA's in design
>
> Thanks to all suggestions.  I found a good app note on the Xilinx site for
> Board Routability Guidelines for Fine Pitch BGA Packages which is very
> helpful.
> As I expected, I got a few direct solicitations from board fab places,
> mostly US, but no good testimonials of good experienced Canadian fab
> houses.
> I really do not want to go across the border at this time as we currently
> do
> not use any fab places outside the country, and it adds a whole other
> level
> of complexity to shipping as well as possible delays especially with
> heightened security these days.
> Regards,
> Genny.
>
> To open another can of worms, most datasheets or app notes have said 'use
> NiAu or OSP finishes'.  We have 99.99% of the time so far used HASL (no
> BGA's), have been made very wary of NiAu and have never tried OSP.  We
> have
> tentatively approved immersion Tin as an alternate finish in select cases
> but have not used it, and I'm hearing a lot about immersion Ag these days.
> Survey:  What do you use for your BGA board finish?
>
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