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November 2001

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Subject:
From:
Peter Lee <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 29 Nov 2001 21:53:57 -0800
Content-Type:
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Hello,

I have asked this question before but did not receive many replies.

Does anyone have any success or suggestion on measuring P&P machine
parameters in line? Such as vacuum pressures, vision alignment error and
placement compensation, placement pressure, drive speed and movement.
Obviously I am setup SPC for my P&P process.

P&P machines that we have in our company do not seem to be "opened"
systems. The only parameters I can measure are indirect - pickup error%,
reject rate, and I went as far as using test vehicles to verify
placement accuracy with AOI. These are however, not direct machine
parameters and do not give me a clear picture of the major moving parts
on the machine.

What other variations within a chip shooting process can one measure and
control?


Rgds,
Peter


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