Some years ago, I was faced with a few flooded boards (conventional
through-hole stuff), and the recovery operation involved removing the
excess solder by reflowing it upside down, removing the components and
putting the now-bare boards through the recently-remembered hydrosqueegee
process to re-level the solder and clear the holes. I shudder slightly at
the mere thought of all those high thermal excursions, but it did return us
useable boards.

Peter Duncan



                    Lou Hart
                    <lhart@COMPUN        To:     [log in to unmask]
                    ETIX.COM>            cc:     (bcc: DUNCAN Peter/Asst Prin Engr/ST
                    Sent by:             Aero/ST Group)
                    TechNet              Subject:     [TN] board dunked in wave solder
                    <[log in to unmask]
                    ORG>


                    11/30/01
                    07:39 AM
                    Please
                    respond to
                    "TechNet
                    E-Mail
                    Forum."






TechNetters, I know there was discussion of this before, many months ago,
but I can't track down the postings in the archives.  Please comment.

We have with solder on some of the top side, surrounding some components
(ICs and passives).  It was dunked in wave solder.  Are boards that have
"submarined" (I think someone used this term in the earlier discussion)
useable if excess solder is removed?  Never useable?  Sometimes?

I could say it's OK, since submarining shouldn't be as bad as HASL, but
would like some expert comments.

Lou Hart
Compunetix Quality Assurance

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